Abstract
Summary
The global semiconductor production equipment market was valued at $71.8 billion in 2020, and is projected to reach $259.7 billion by 2030, registering a CAGR of 12.9% from 2021 to 2030. Semiconductor manufacturing is a challenging procedure that ensures the quality of a variety of semiconductor devices. Semiconductor manufacturing equipment is used to protect semiconductor part assembly, overall device testing, and wafer fabrication. The growing demand for electronics and gadget services has aided the growth of the semiconductor manufacturing equipment market significantly.
During the projection period, the global semiconductor manufacturing equipment market is anticipated to benefit from increased demand for silicon-based sensors in IoT, China's developing chip sector, and the growing number of data centers and servers. The market's growth is hampered by high equipment costs and maintenance as well as the complexity of pattern and functional defects in the production process. Technical issues encountered during the building process and increased complexity associated with decreased circuit structures are the primary roadblocks to the semiconductor manufacturing equipment market growth.
Various key players are improving their product portfolio by launching latest and most advanced technology semiconductor production equipment and also strengthening market position by implementing various strategic moves such as partnership, acquisition, expanding business, and product launch. For instance, in December 2020, Tokyo Electron has launched CELLESTA SCD single wafer system, which is used in silicon wafers in semiconductor manufacturing process. Thus, these strategic moves by key players are expected to increase the demand for semiconductor production equipment in the market during forecast period.
The semiconductor production equipment market is segmented on the basis of product type, function, dimension, supply chain process, and region. By product type, the market is divided into front end equipment and back end equipment. By function, it is bifurcated into integrated and OSD. By dimension, it is classified into 2D, 2.5D, and 3D. By supply chain process, the market is fragmented into IDM, OSAT, and foundry. Region-wise, the market analysis is conducted across North America (the U.S., Canada, and Mexico), Europe (Germany, France, the UK, Italy, and Rest of Europe), Asia-Pacific (China, Taiwan, South Korea, Japan, and Rest of Asia-Pacific), and LAMEA (Latin America, the Middle East, and Africa).
COMPETITION ANALYSIS
Key companies profiled in the semiconductor production equipment market report include AlsilMaterial, Applied Materials Inc., ASML Holdings N.V., Intel Corporation, Micron Technology Inc., Qualcomm Technologies, Inc., Samsung Group, Screen Holdings Co., Ltd., Teradyne Inc., and Tokyo Electron Limited.
KEY BENEFITS FOR STAKEHOLDERS
The report provides an extensive analysis of the current and emerging semiconductor production equipment market trends and dynamics.
In-depth market analysis is conducted by constructing market estimations for the key market segments between 2020 and 2030.
Extensive analysis of the semiconductor production equipment market is conducted by following key product positioning and monitoring of the top competitors within the market framework.
A comprehensive analysis of all regions is provided to determine the prevailing opportunities.
The global semiconductor production equipment market forecast analysis from 2021 to 2030 is included in the report.
The key market players within the semiconductor production equipment market are profiled in this report and their strategies are analyzed thoroughly, which help understand the competitive outlook of the semiconductor production equipment industry.
KEY SEGMENTS
BY PRODUCT TYPE
• Front End Equipment
• Back End Equipment
BY FUNCTION
• Integrated
• OSD
BY DIMENSION
• 2D
• 2.5D
• 3D
BY SUPPLY CHAIN PROCESS
• IDM
• OSAT
• Foundry
BY REGION
• North America
o U.S.
o Canada
o Mexico
• Europe
o Germany
o UK
o France
o Italy
o Rest of Europe
• Asia-Pacific
o China
o Taiwan
o South Korea
o Japan
o Rest of Asia-Pacific
• LAMEA
o Latin America
o Middle East
o Africa
KEY PLAYERS
• AlsilMaterial
• Applied Materials Inc.
• ASML Holdings N.V.
• Intel Corporation
• Micron Technology Inc.
• Qualcomm Technologies, Inc.
• Samsung Group
• Screen Holdings Co., Ltd.
• Teradyne Inc.
• Tokyo Electron Limited.
Table of Contents
1 INTRODUCTION
1.1 Report description
1.2 Key benefits for stakeholders
1.3 Key market segments
1.4 Research methodology
1.4.1 Primary research
1.4.2 Secondary research
1.4.3 Analyst tools and models
2 EXECUTIVE SUMMARY
2.1 Key findings of the study
2.2 CXO perspective
3 MARKET OVERVIEW
3.1 Market definition and scope
3.2 Key findings
3.2.1 Top investment pockets
3.2.2 Top winning strategies
3.3 Market player positioning, 2020
3.4 Porter's five forces analysis
3.5 Market dynamics
3.5.1 Drivers
- 3.5.1.1 Rise in demand for electronics products
- 3.5.1.2 Growth in demand for hybrid circuits from medical, military, photonics, and wireless electronics applications
- 3.5.1.3 Growth of the semiconductor packaging industry
3.5.2 Restraint
- 3.5.2.1 Fluctuation in raw material prices
3.5.3 Opportunities
- 3.5.3.1 Growth in usage of LED circuits
3.6 COVID-19 Impact Analysis
4 SEMICONDUCTOR PRODUCTION EQUIPMENT MARKET, BY PRODUCT TYPE
4.1 Overview
4.1.1 Market size and forecast, by product type
4.2 Front end equipment
4.2.1 Key market trends, growth factors, and opportunities
4.2.2 Market size and forecast, by region
4.2.3 Market size and forecast, by front-end equipment
- 4.2.3.1 Silicon wafer manufacturing equipment
- 4.2.3.2 Wafer processing equipment
4.2.4 Market size and forecast, by country
4.3 Back end equipment
4.3.1 Key market trends, growth factors, and opportunities
4.3.2 Market size and forecast, by region
4.3.3 Market size and forecast, by back end equipment
- 4.3.3.1 Testing equipment
- 4.3.3.2 Assembly and packaging equipment
4.3.4 Market size and forecast, by country
5 SEMICONDUCTOR PRODUCTION EQUIPMENT MARKET, BY FUNCTION
5.1 Overview
5.1.1 Market size and forecast, by function
5.2 Integrated Circuits
5.2.1 Key market trends, growth factors, and opportunities
5.2.2 Market size and forecast, by region
5.2.3 Market size and forecast, by integrated circuits
- 5.2.3.1 Microprocessors and logic devices
- 5.2.3.2 Analog devices
5.2.4 Market size and forecast, by country
5.3 OSD
5.3.1 Key market trends, growth factors, and opportunities
5.3.2 Market size and forecast, by region
5.3.3 Market size and forecast, by country
6 SEMICONDUCTOR PRODUCTION EQUIPMENT MARKET, BY DIMENSION
6.1 Overview
6.1.1 Market size and forecast, by dimension
6.2 (2) Dimension
6.2.1 Key market trends, growth factors, and opportunities
6.2.2 Market size and forecast, by region
6.2.3 Market size and forecast, by country
6.3 (2.5) Dimension
6.3.1 Key market trends, growth factors, and opportunities
6.3.2 Market size and forecast, by region
6.3.3 Market size and forecast, by country
6.4 (3) Dimension
6.4.1 Key market trends, growth factors, and opportunities
6.4.2 Market size and forecast, by region
6.4.3 Market size and forecast, by country
7 SEMICONDUCTOR PRODUCTION EQUIPMENT MARKET, BY SUPPLY CHAIN PROCESS
7.1 Overview
7.1.1 Market size and forecast, by supply chain process
7.2 IDM
7.2.1 Key market trends, growth factors, and opportunities
7.2.2 Market size and forecast, by region
7.2.3 Market size and forecast, by country
7.3 OSAT
7.3.1 Key market trends, growth factors, and opportunities
7.3.2 Market size and forecast, by region
7.3.3 Market size and forecast, by country
7.4 Foundry
7.4.1 Key market trends, growth factors, and opportunities
7.4.2 Market size and forecast, by region
7.4.3 Market size and forecast, by country
8 SEMICONDUCTOR PRODUCTION EQUIPMENT MARKET, BY REGION
8.1 Market overview
8.1.1 Market size and forecast, by region
8.2 North America
8.2.1 Key market trends, growth factors, and opportunities
8.2.2 North America market size and forecast, by product type
- 8.2.2.1 Market size and forecast, by front end equipment
- 8.2.2.2 Market size and forecast, by back end equipment
8.2.3 North America market size and forecast, by function
- 8.2.3.1 Market size and forecast, by integrated circuits
8.2.4 North America market size and forecast, by dimension
8.2.5 North America market size and forecast, by supply chain process
8.2.6 North America market size and forecast, by country
- 8.2.6.1 U.S
- 8.2.6.1.1 U.S. market size and forecast, by product type
- 8.2.6.1.2 U.S. market size and forecast, by function
- 8.2.6.1.3 U.S. market size and forecast, by dimension
- 8.2.6.1.4 U.S. market size and forecast, by supply chain process
- 8.2.6.2 Canada
- 8.2.6.2.1 Canada market size and forecast, by product type
- 8.2.6.2.2 Canada market size and forecast, by function
- 8.2.6.2.3 Canada market size and forecast, by dimension
- 8.2.6.2.4 Canada market size and forecast, by supply chain process
- 8.2.6.3 Mexico
- 8.2.6.3.1 Mexico market size and forecast, by product type
- 8.2.6.3.2 Mexico market size and forecast, by function
- 8.2.6.3.3 Mexico market size and forecast, by dimension
- 8.2.6.3.4 Mexico market size and forecast, by supply chain process
- 8.2.6.1 U.S
8.3 Europe
8.3.1 Key market trends, growth factors, and opportunities
8.3.2 Europe market size and forecast, by product type
- 8.3.2.1 Market size and forecast, by front end equipment
- 8.3.2.2 Market size and forecast, by back end equipment
8.3.3 Europe market size and forecast, by function
- 8.3.3.1 Market size and forecast, by integrated circuits
8.3.4 Europe market size and forecast, by dimension
8.3.5 Europe market size and forecast, by supply chain process
8.3.6 Europe market size and forecast, by country
- 8.3.6.1 Germany
- 8.3.6.1.1 Germany market size and forecast, by product type
- 8.3.6.1.2 Germany market size and forecast, by function
- 8.3.6.1.3 Germany market size and forecast, by dimension
- 8.3.6.1.4 Germany market size and forecast, by supply chain process
- 8.3.6.2 France
- 8.3.6.2.1 France market size and forecast, by product type
- 8.3.6.2.2 France market size and forecast, by function
- 8.3.6.2.3 France market size and forecast, by dimension
- 8.3.6.2.4 France market size and forecast, by supply chain process
- 8.3.6.3 UK
- 8.3.6.3.1 UK market size and forecast, by product type
- 8.3.6.3.2 UK market size and forecast, by function
- 8.3.6.3.3 UK market size and forecast, by dimension
- 8.3.6.3.4 UK market size and forecast, by supply chain process
- 8.3.6.4 Italy
- 8.3.6.4.1 Italy market size and forecast, by product type
- 8.3.6.4.2 Italy market size and forecast, by function
- 8.3.6.4.3 Italy market size and forecast, by dimension
- 8.3.6.4.4 Italy market size and forecast, by supply chain process
- 8.3.6.5 Rest of Europe
- 8.3.6.5.1 Rest of Europe market size and forecast, by product type
- 8.3.6.5.2 Rest of Europe market size and forecast, by function
- 8.3.6.5.3 Rest of Europe market size and forecast, by dimension
- 8.3.6.5.4 Rest of Europe market size and forecast, by supply chain process
- 8.3.6.1 Germany
8.4 Asia-Pacific
8.4.1 Key market trends, growth factors, and opportunities
8.4.2 Asia-Pacific market size and forecast, by product type
- 8.4.2.1 Market size and forecast, by front end equipment
- 8.4.2.2 Market size and forecast, by back end equipment
8.4.3 Asia-Pacific market size and forecast, by function
- 8.4.3.1 Market size and forecast, by integrated circuits
8.4.4 Asia-Pacific market size and forecast, by dimension
8.4.5 Asia-Pacific market size and forecast, by supply chain process
8.4.6 Asia-Pacific market size and forecast, by country
- 8.4.6.1 China
- 8.4.6.1.1 China market size and forecast, by product type
- 8.4.6.1.2 China market size and forecast, by function
- 8.4.6.1.3 China market size and forecast, by dimension
- 8.4.6.1.4 China market size and forecast, by supply chain process
- 8.4.6.2 Taiwan
- 8.4.6.2.1 India market size and forecast, by product type
- 8.4.6.2.2 Taiwan market size and forecast, by function
- 8.4.6.2.3 Taiwan market size and forecast, by dimension
- 8.4.6.2.4 Taiwan market size and forecast, by supply chain process
- 8.4.6.3 South Korea
- 8.4.6.3.1 South Korea market size and forecast, by product type
- 8.4.6.3.2 South Korea market size and forecast, by function
- 8.4.6.3.3 South Korea market size and forecast, by dimension
- 8.4.6.3.4 South Korea market size and forecast, by supply chain process
- 8.4.6.4 Japan
- 8.4.6.4.1 Japan market size and forecast, by product type
- 8.4.6.4.2 Japan market size and forecast, by function
- 8.4.6.4.3 Japan market size and forecast, by dimension
- 8.4.6.4.4 Japan market size and forecast, by supply chain process
- 8.4.6.5 Rest of Asia-Pacific
- 8.4.6.5.1 Rest of Asia-Pacific market size and forecast, by product type
- 8.4.6.5.2 Rest of Asia-Pacific market size and forecast, by function
- 8.4.6.5.3 Rest of Asia-Pacific market size and forecast, by dimension
- 8.4.6.5.4 Rest of Asia-Pacific market size and forecast, by supply chain process
- 8.4.6.1 China
8.5 LAMEA
8.5.1 Key market trends, growth factors, and opportunities
8.5.2 LAMEA market size and forecast, by product type
- 8.5.2.1 Market size and forecast, by front end equipment
- 8.5.2.2 Market size and forecast, by back end equipment
8.5.3 LAMEA market size and forecast, by function
- 8.5.3.1 Market size and forecast, by integrated circuits
8.5.4 LAMEA market size and forecast, by dimension
8.5.5 LAMEA market size and forecast, by supply chain process
8.5.6 LAMEA market size and forecast, by country
- 8.5.6.1 Latin America
- 8.5.6.1.1 Latin America market size and forecast, by product type
- 8.5.6.1.2 Latin America market size and forecast, by function
- 8.5.6.1.3 Latin America market size and forecast, by dimension
- 8.5.6.1.4 Latin America market size and forecast, by supply chain process
- 8.5.6.2 Middle East
- 8.5.6.2.1 Middle East market size and forecast, by product type
- 8.5.6.2.2 Middle East market size and forecast, by function
- 8.5.6.2.3 Middle East market size and forecast, by dimension
- 8.5.6.2.4 Middle East market size and forecast, by supply chain process
- 8.5.6.3 Africa
- 8.5.6.3.1 Africa market size and forecast, by product type
- 8.5.6.3.2 Africa market size and forecast, by function
- 8.5.6.3.3 Africa market size and forecast, by dimension
- 8.5.6.3.4 Africa market size and forecast, by supply chain process
- 8.5.6.1 Latin America
9 COMPANY PROFILES
9.1 ALSILMATERIAL
9.1.1 Company overview
9.1.2 Key executive
9.1.3 Company snapshot
9.1.4 Product portfolio
9.2 APPLIED MATERIALS, INC
9.2.1 Company overview
9.2.2 Key executive
9.2.3 Company snapshot
9.2.4 Operating business segments
9.2.5 Product portfolio
9.2.6 R&D expenditure
9.2.7 Business performance
9.2.8 Key strategic moves and developments
9.3 ASML HOLDING N.V
9.3.1 Company overview
9.3.2 Key executive
9.3.3 Company snapshot
9.3.4 Operating business segments
9.3.5 Product portfolio
9.3.6 R&D expenditure
9.3.7 Business performance
9.4 INTEL CORPORATION
9.4.1 Company overview
9.4.2 Key executive
9.4.3 Company snapshot
9.4.4 Operating business segments
9.4.5 Product portfolio
9.4.6 R&D expenditure
9.4.7 Business performance
9.4.8 Key strategic moves and developments
9.5 MICRON TECHNOLOGY, INC
9.5.1 Company overview
9.5.2 Key executive
9.5.3 Company snapshot
9.5.4 Operating business segments
9.5.5 Product portfolio
9.5.6 R&D expenditure
9.5.7 Business performance
9.5.8 Key strategic moves and developments
9.6 QUALCOMM TECHNOLOGIES, INC
9.6.1 Company overview
9.6.2 Key executive
9.6.3 Company snapshot
9.6.4 Operating business segments
9.6.5 Product portfolio
9.6.6 R&D expenditure
9.6.7 Business performance
9.6.8 Key strategic moves and developments
9.7 SAMSUNG ELECTRONICS CO., LTD
9.7.1 Company overview
9.7.2 Key executive
9.7.3 Company snapshot
9.7.4 Operating business segments
9.7.5 Product portfolio
9.7.6 R&D expenditure
9.7.7 Business performance
9.7.8 Key strategic moves and developments
9.8 SCREEN HOLDINGS CO., LTD
9.8.1 Company overview
9.8.2 Key executive
9.8.3 Company snapshot
9.8.4 Operating business segments
9.8.5 Product portfolio
9.8.6 R&D expenditure
9.8.7 Business performance
9.8.8 Key strategic moves and developments
9.9 TERADYNE INC
9.9.1 Company overview
9.9.2 Key executive
9.9.3 Company snapshot
9.9.4 Operating business segments
9.9.5 Product portfolio
9.9.6 Business performance
9.9.7 Key strategic moves and developments
9.10 TOKYO ELECTRON LIMITED
9.10.1 Company overview
9.10.2 Key executive
9.10.3 Company snapshot
9.10.4 Operating business segments
9.10.5 Product portfolio
9.10.6 R&D expenditure
9.10.7 Business performance
9.10.8 Key strategic moves and developments