Abstract
Summary
Package on package (PoP) is an integrated circuit packaging method to combine vertically discrete logic and memory ball grid array (BGA) packages. Two or more packages are installed atop each other, i.e. stacked, with a standard interface to route signals between them. This allows higher component density in devices, such as mobile phones, personal digital assistants (PDA), and digital cameras.
LPI (LP Information)' newest research report, the “Package on package (PoP) Industry Forecast” looks at past sales and reviews total world Package on package (PoP) sales in 2022, providing a comprehensive analysis by region and market sector of projected Package on package (PoP) sales for 2023 through 2029. With Package on package (PoP) sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Package on package (PoP) industry.
This Insight Report provides a comprehensive analysis of the global Package on package (PoP) landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Package on package (PoP) portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms' unique position in an accelerating global Package on package (PoP) market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Package on package (PoP) and breaks down the forecast by technology, by application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Package on package (PoP).
The global Package on package (PoP) market size is projected to grow from US$ million in 2022 to US$ million in 2029; it is expected to grow at a CAGR of % from 2023 to 2029.
United States market for Package on package (PoP) is estimated to increase from US$ million in 2022 to US$ million by 2029, at a CAGR of % from 2023 through 2029.
China market for Package on package (PoP) is estimated to increase from US$ million in 2022 to US$ million by 2029, at a CAGR of % from 2023 through 2029.
Europe market for Package on package (PoP) is estimated to increase from US$ million in 2022 to US$ million by 2029, at a CAGR of % from 2023 through 2029.
Global key Package on package (PoP) players cover Eesemi, Surface Mount Technology Association, PCBCart, Amkor Technology, Micron Technoloty, Semicon, Finetech and Circuitnet, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2022.
This report presents a comprehensive overview, market shares, and growth opportunities of Package on package (PoP) market by product technology, application, key manufacturers and key regions and countries.
Market Segmentation:
Segmentation by technology
Traditional POP
PSfcCSP
Through-Mold-Via
Exposed-die TMV
Segmentation by application
Mobile Phones
Digital Cameras
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
Eesemi
Surface Mount Technology Association
PCBCart
Amkor Technology
Micron Technoloty
Semicon
Finetech
Circuitnet
Key Questions Addressed in this Report
What is the 10-year outlook for the global Package on package (PoP) market?
What factors are driving Package on package (PoP) market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Package on package (PoP) market opportunities vary by end market size?
How does Package on package (PoP) break out technology, application?
What are the influences of COVID-19 and Russia-Ukraine war?
LPI (LP Information)' newest research report, the “Package on package (PoP) Industry Forecast” looks at past sales and reviews total world Package on package (PoP) sales in 2022, providing a comprehensive analysis by region and market sector of projected Package on package (PoP) sales for 2023 through 2029. With Package on package (PoP) sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Package on package (PoP) industry.
This Insight Report provides a comprehensive analysis of the global Package on package (PoP) landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Package on package (PoP) portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms' unique position in an accelerating global Package on package (PoP) market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Package on package (PoP) and breaks down the forecast by technology, by application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Package on package (PoP).
The global Package on package (PoP) market size is projected to grow from US$ million in 2022 to US$ million in 2029; it is expected to grow at a CAGR of % from 2023 to 2029.
United States market for Package on package (PoP) is estimated to increase from US$ million in 2022 to US$ million by 2029, at a CAGR of % from 2023 through 2029.
China market for Package on package (PoP) is estimated to increase from US$ million in 2022 to US$ million by 2029, at a CAGR of % from 2023 through 2029.
Europe market for Package on package (PoP) is estimated to increase from US$ million in 2022 to US$ million by 2029, at a CAGR of % from 2023 through 2029.
Global key Package on package (PoP) players cover Eesemi, Surface Mount Technology Association, PCBCart, Amkor Technology, Micron Technoloty, Semicon, Finetech and Circuitnet, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2022.
This report presents a comprehensive overview, market shares, and growth opportunities of Package on package (PoP) market by product technology, application, key manufacturers and key regions and countries.
Market Segmentation:
Segmentation by technology
Traditional POP
PSfcCSP
Through-Mold-Via
Exposed-die TMV
Segmentation by application
Mobile Phones
Digital Cameras
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
Eesemi
Surface Mount Technology Association
PCBCart
Amkor Technology
Micron Technoloty
Semicon
Finetech
Circuitnet
Key Questions Addressed in this Report
What is the 10-year outlook for the global Package on package (PoP) market?
What factors are driving Package on package (PoP) market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Package on package (PoP) market opportunities vary by end market size?
How does Package on package (PoP) break out technology, application?
What are the influences of COVID-19 and Russia-Ukraine war?
Table of Contents
1 Scope of the Report
1.1 Market Introduction
1.2 Years Considered
1.3 Research Objectives
1.4 Market Research Methodology
1.5 Research Process and Data Source
1.6 Economic Indicators
1.7 Currency Considered
1.8 Market Estimation Caveats
2 Executive Summary
2.1 World Market Overview
2.1.1 Global Package on package (PoP) Annual Sales 2018-2029
2.1.2 World Current & Future Analysis for Package on package (PoP) by Geographic Region, 2018, 2022 & 2029
2.1.3 World Current & Future Analysis for Package on package (PoP) by Country/Region, 2018, 2022 & 2029
2.2 Package on package (PoP) Segment by Technology
2.2.1 Traditional POP
2.2.2 PSfcCSP
2.2.3 Through-Mold-Via
2.2.4 Exposed-die TMV
2.3 Package on package (PoP) Sales by Technology
2.3.1 Global Package on package (PoP) Sales Market Share by Technology (2018-2023)
2.3.2 Global Package on package (PoP) Revenue and Market Share by Technology (2018-2023)
2.3.3 Global Package on package (PoP) Sale Price by Technology (2018-2023)
2.4 Package on package (PoP) Segment by Application
2.4.1 Mobile Phones
2.4.2 Digital Cameras
2.4.3 Others
2.5 Package on package (PoP) Sales by Application
2.5.1 Global Package on package (PoP) Sale Market Share by Application (2018-2023)
2.5.2 Global Package on package (PoP) Revenue and Market Share by Application (2018-2023)
2.5.3 Global Package on package (PoP) Sale Price by Application (2018-2023)
3 Global Package on package (PoP) by Company
3.1 Global Package on package (PoP) Breakdown Data by Company
3.1.1 Global Package on package (PoP) Annual Sales by Company (2018-2023)
3.1.2 Global Package on package (PoP) Sales Market Share by Company (2018-2023)
3.2 Global Package on package (PoP) Annual Revenue by Company (2018-2023)
3.2.1 Global Package on package (PoP) Revenue by Company (2018-2023)
3.2.2 Global Package on package (PoP) Revenue Market Share by Company (2018-2023)
3.3 Global Package on package (PoP) Sale Price by Company
3.4 Key Manufacturers Package on package (PoP) Producing Area Distribution, Sales Area, Product Type
3.4.1 Key Manufacturers Package on package (PoP) Product Location Distribution
3.4.2 Players Package on package (PoP) Products Offered
3.5 Market Concentration Rate Analysis
3.5.1 Competition Landscape Analysis
3.5.2 Concentration Ratio (CR3, CR5 and CR10) & (2018-2023)
3.6 New Products and Potential Entrants
3.7 Mergers & Acquisitions, Expansion
4 World Historic Review for Package on package (PoP) by Geographic Region
4.1 World Historic Package on package (PoP) Market Size by Geographic Region (2018-2023)
4.1.1 Global Package on package (PoP) Annual Sales by Geographic Region (2018-2023)
4.1.2 Global Package on package (PoP) Annual Revenue by Geographic Region (2018-2023)
4.2 World Historic Package on package (PoP) Market Size by Country/Region (2018-2023)
4.2.1 Global Package on package (PoP) Annual Sales by Country/Region (2018-2023)
4.2.2 Global Package on package (PoP) Annual Revenue by Country/Region (2018-2023)
4.3 Americas Package on package (PoP) Sales Growth
4.4 APAC Package on package (PoP) Sales Growth
4.5 Europe Package on package (PoP) Sales Growth
4.6 Middle East & Africa Package on package (PoP) Sales Growth
5 Americas
5.1 Americas Package on package (PoP) Sales by Country
5.1.1 Americas Package on package (PoP) Sales by Country (2018-2023)
5.1.2 Americas Package on package (PoP) Revenue by Country (2018-2023)
5.2 Americas Package on package (PoP) Sales by Technology
5.3 Americas Package on package (PoP) Sales by Application
5.4 United States
5.5 Canada
5.6 Mexico
5.7 Brazil
6 APAC
6.1 APAC Package on package (PoP) Sales by Region
6.1.1 APAC Package on package (PoP) Sales by Region (2018-2023)
6.1.2 APAC Package on package (PoP) Revenue by Region (2018-2023)
6.2 APAC Package on package (PoP) Sales by Technology
6.3 APAC Package on package (PoP) Sales by Application
6.4 China
6.5 Japan
6.6 South Korea
6.7 Southeast Asia
6.8 India
6.9 Australia
6.10 China Taiwan
7 Europe
7.1 Europe Package on package (PoP) by Country
7.1.1 Europe Package on package (PoP) Sales by Country (2018-2023)
7.1.2 Europe Package on package (PoP) Revenue by Country (2018-2023)
7.2 Europe Package on package (PoP) Sales by Technology
7.3 Europe Package on package (PoP) Sales by Application
7.4 Germany
7.5 France
7.6 UK
7.7 Italy
7.8 Russia
8 Middle East & Africa
8.1 Middle East & Africa Package on package (PoP) by Country
8.1.1 Middle East & Africa Package on package (PoP) Sales by Country (2018-2023)
8.1.2 Middle East & Africa Package on package (PoP) Revenue by Country (2018-2023)
8.2 Middle East & Africa Package on package (PoP) Sales by Technology
8.3 Middle East & Africa Package on package (PoP) Sales by Application
8.4 Egypt
8.5 South Africa
8.6 Israel
8.7 Turkey
8.8 GCC Countries
9 Market Drivers, Challenges and Trends
9.1 Market Drivers & Growth Opportunities
9.2 Market Challenges & Risks
9.3 Industry Trends
10 Manufacturing Cost Structure Analysis
10.1 Raw Material and Suppliers
10.2 Manufacturing Cost Structure Analysis of Package on package (PoP)
10.3 Manufacturing Process Analysis of Package on package (PoP)
10.4 Industry Chain Structure of Package on package (PoP)
11 Marketing, Distributors and Customer
11.1 Sales Channel
11.1.1 Direct Channels
11.1.2 Indirect Channels
11.2 Package on package (PoP) Distributors
11.3 Package on package (PoP) Customer
12 World Forecast Review for Package on package (PoP) by Geographic Region
12.1 Global Package on package (PoP) Market Size Forecast by Region
12.1.1 Global Package on package (PoP) Forecast by Region (2024-2029)
12.1.2 Global Package on package (PoP) Annual Revenue Forecast by Region (2024-2029)
12.2 Americas Forecast by Country
12.3 APAC Forecast by Region
12.4 Europe Forecast by Country
12.5 Middle East & Africa Forecast by Country
12.6 Global Package on package (PoP) Forecast by Technology
12.7 Global Package on package (PoP) Forecast by Application
13 Key Players Analysis
13.1 Eesemi
13.1.1 Eesemi Company Information
13.1.2 Eesemi Package on package (PoP) Product Portfolios and Specifications
13.1.3 Eesemi Package on package (PoP) Sales, Revenue, Price and Gross Margin (2018-2023)
13.1.4 Eesemi Main Business Overview
13.1.5 Eesemi Latest Developments
13.2 Surface Mount Technology Association
13.2.1 Surface Mount Technology Association Company Information
13.2.2 Surface Mount Technology Association Package on package (PoP) Product Portfolios and Specifications
13.2.3 Surface Mount Technology Association Package on package (PoP) Sales, Revenue, Price and Gross Margin (2018-2023)
13.2.4 Surface Mount Technology Association Main Business Overview
13.2.5 Surface Mount Technology Association Latest Developments
13.3 PCBCart
13.3.1 PCBCart Company Information
13.3.2 PCBCart Package on package (PoP) Product Portfolios and Specifications
13.3.3 PCBCart Package on package (PoP) Sales, Revenue, Price and Gross Margin (2018-2023)
13.3.4 PCBCart Main Business Overview
13.3.5 PCBCart Latest Developments
13.4 Amkor Technology
13.4.1 Amkor Technology Company Information
13.4.2 Amkor Technology Package on package (PoP) Product Portfolios and Specifications
13.4.3 Amkor Technology Package on package (PoP) Sales, Revenue, Price and Gross Margin (2018-2023)
13.4.4 Amkor Technology Main Business Overview
13.4.5 Amkor Technology Latest Developments
13.5 Micron Technoloty
13.5.1 Micron Technoloty Company Information
13.5.2 Micron Technoloty Package on package (PoP) Product Portfolios and Specifications
13.5.3 Micron Technoloty Package on package (PoP) Sales, Revenue, Price and Gross Margin (2018-2023)
13.5.4 Micron Technoloty Main Business Overview
13.5.5 Micron Technoloty Latest Developments
13.6 Semicon
13.6.1 Semicon Company Information
13.6.2 Semicon Package on package (PoP) Product Portfolios and Specifications
13.6.3 Semicon Package on package (PoP) Sales, Revenue, Price and Gross Margin (2018-2023)
13.6.4 Semicon Main Business Overview
13.6.5 Semicon Latest Developments
13.7 Finetech
13.7.1 Finetech Company Information
13.7.2 Finetech Package on package (PoP) Product Portfolios and Specifications
13.7.3 Finetech Package on package (PoP) Sales, Revenue, Price and Gross Margin (2018-2023)
13.7.4 Finetech Main Business Overview
13.7.5 Finetech Latest Developments
13.8 Circuitnet
13.8.1 Circuitnet Company Information
13.8.2 Circuitnet Package on package (PoP) Product Portfolios and Specifications
13.8.3 Circuitnet Package on package (PoP) Sales, Revenue, Price and Gross Margin (2018-2023)
13.8.4 Circuitnet Main Business Overview
13.8.5 Circuitnet Latest Developments
14 Research Findings and Conclusion