In the printed circuit board, copper is used to interconnect components on a substrate , although it is to form a conductive path printed circuit board graphics board good conductor material , but if prolonged exposure to air , but also it is easy to lose luster due to oxidation , corrosion and loss suffered due weldability . Therefore, you must use a variety of techniques to protect the copper traces , vias , and plated through holes , such techniques include the organic coating, the oxide film and plating techniques .
Metal plating or coating process is to ensure weldability and corrosion protection circuit to avoid the standard operation, the circuit board manufacturing plays an important role in the single-sided , double-sided and multilayer printed . In particular, the plating layer having a printed line of the weld metal has become a solder protective layer provided for the operation of a standard copper tracks .
Development occurs in electroplating , through the development of automated computer -controlled plating equipment , conduct chemical analysis of organic and metallic additives in highly complex instrument technology, and precise control of the chemical reaction process technology, electroplating technology to achieve a high level.
LPI (LP Information)' newest research report, the “PCB Plating Equipment Industry Forecast” looks at past sales and reviews total world PCB Plating Equipment sales in 2022, providing a comprehensive analysis by region and market sector of projected PCB Plating Equipment sales for 2023 through 2029. With PCB Plating Equipment sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world PCB Plating Equipment industry.
This Insight Report provides a comprehensive analysis of the global PCB Plating Equipment landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on PCB Plating Equipment portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global PCB Plating Equipment market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for PCB Plating Equipment and breaks down the forecast by type, by application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global PCB Plating Equipment.
The global PCB Plating Equipment market size is projected to grow from US$ million in 2022 to US$ million in 2029; it is expected to grow at a CAGR of % from 2023 to 2029.
United States market for PCB Plating Equipment is estimated to increase from US$ million in 2022 to US$ million by 2029, at a CAGR of % from 2023 through 2029.
China market for PCB Plating Equipment is estimated to increase from US$ million in 2022 to US$ million by 2029, at a CAGR of % from 2023 through 2029.
Europe market for PCB Plating Equipment is estimated to increase from US$ million in 2022 to US$ million by 2029, at a CAGR of % from 2023 through 2029.
Global key PCB Plating Equipment players cover Atotech, EEJA, Dongguan UCE Group, Kunshan Dongwei Technology, George Koch Sons, PAT, PAL, Commend Machinery and AEL, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2022.
This report presents a comprehensive overview, market shares, and growth opportunities of PCB Plating Equipment market by product type, application, key players and key regions and countries.
Market Segmentation:
Segmentation by type
VCP
Vertical Lift Plating Equipment
Horizontal Plating Equipment
Segmentation by application
Flexible Board
Rigid Board
Rigid-flex Board
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
Atotech
EEJA
Dongguan UCE Group
Kunshan Dongwei Technology
George Koch Sons
PAT
PAL
Commend Machinery
AEL
TKC Co., Ltd
Jastech
KOVOFINIS
JCU
Technic Inc
Besi
Gangmu Machinery

1 Scope of the Report 1.1 Market Introduction 1.2 Years Considered 1.3 Research Objectives 1.4 Market Research Methodology 1.5 Research Process and Data Source 1.6 Economic Indicators 1.7 Currency Considered 1.8 Market Estimation Caveats 2 Executive Summary 2.1 World Market Overview 2.1.1 Global PCB Plating Equipment Market Size 2018-2029 2.1.2 PCB Plating Equipment Market Size CAGR by Region 2018 VS 2022 VS 2029 2.2 PCB Plating Equipment Segment by Type 2.2.1 VCP 2.2.2 Vertical Lift Plating Equipment 2.2.3 Horizontal Plating Equipment 2.3 PCB Plating Equipment Market Size by Type 2.3.1 PCB Plating Equipment Market Size CAGR by Type (2018 VS 2022 VS 2029) 2.3.2 Global PCB Plating Equipment Market Size Market Share by Type (2018-2023) 2.4 PCB Plating Equipment Segment by Application 2.4.1 Flexible Board 2.4.2 Rigid Board 2.4.3 Rigid-flex Board 2.5 PCB Plating Equipment Market Size by Application 2.5.1 PCB Plating Equipment Market Size CAGR by Application (2018 VS 2022 VS 2029) 2.5.2 Global PCB Plating Equipment Market Size Market Share by Application (2018-2023) 3 PCB Plating Equipment Market Size by Player 3.1 PCB Plating Equipment Market Size Market Share by Players 3.1.1 Global PCB Plating Equipment Revenue by Players (2018-2023) 3.1.2 Global PCB Plating Equipment Revenue Market Share by Players (2018-2023) 3.2 Global PCB Plating Equipment Key Players Head office and Products Offered 3.3 Market Concentration Rate Analysis 3.3.1 Competition Landscape Analysis 3.3.2 Concentration Ratio (CR3, CR5 and CR10) & (2021-2023) 3.4 New Products and Potential Entrants 3.5 Mergers & Acquisitions, Expansion 4 PCB Plating Equipment by Regions 4.1 PCB Plating Equipment Market Size by Regions (2018-2023) 4.2 Americas PCB Plating Equipment Market Size Growth (2018-2023) 4.3 APAC PCB Plating Equipment Market Size Growth (2018-2023) 4.4 Europe PCB Plating Equipment Market Size Growth (2018-2023) 4.5 Middle East & Africa PCB Plating Equipment Market Size Growth (2018-2023) 5 Americas 5.1 Americas PCB Plating Equipment Market Size by Country (2018-2023) 5.2 Americas PCB Plating Equipment Market Size by Type (2018-2023) 5.3 Americas PCB Plating Equipment Market Size by Application (2018-2023) 5.4 United States 5.5 Canada 5.6 Mexico 5.7 Brazil 6 APAC 6.1 APAC PCB Plating Equipment Market Size by Region (2018-2023) 6.2 APAC PCB Plating Equipment Market Size by Type (2018-2023) 6.3 APAC PCB Plating Equipment Market Size by Application (2018-2023) 6.4 China 6.5 Japan 6.6 Korea 6.7 Southeast Asia 6.8 India 6.9 Australia 7 Europe 7.1 Europe PCB Plating Equipment by Country (2018-2023) 7.2 Europe PCB Plating Equipment Market Size by Type (2018-2023) 7.3 Europe PCB Plating Equipment Market Size by Application (2018-2023) 7.4 Germany 7.5 France 7.6 UK 7.7 Italy 7.8 Russia 8 Middle East & Africa 8.1 Middle East & Africa PCB Plating Equipment by Region (2018-2023) 8.2 Middle East & Africa PCB Plating Equipment Market Size by Type (2018-2023) 8.3 Middle East & Africa PCB Plating Equipment Market Size by Application (2018-2023) 8.4 Egypt 8.5 South Africa 8.6 Israel 8.7 Turkey 8.8 GCC Countries 9 Market Drivers, Challenges and Trends 9.1 Market Drivers & Growth Opportunities 9.2 Market Challenges & Risks 9.3 Industry Trends 10 Global PCB Plating Equipment Market Forecast 10.1 Global PCB Plating Equipment Forecast by Regions (2024-2029) 10.1.1 Global PCB Plating Equipment Forecast by Regions (2024-2029) 10.1.2 Americas PCB Plating Equipment Forecast 10.1.3 APAC PCB Plating Equipment Forecast 10.1.4 Europe PCB Plating Equipment Forecast 10.1.5 Middle East & Africa PCB Plating Equipment Forecast 10.2 Americas PCB Plating Equipment Forecast by Country (2024-2029) 10.2.1 United States PCB Plating Equipment Market Forecast 10.2.2 Canada PCB Plating Equipment Market Forecast 10.2.3 Mexico PCB Plating Equipment Market Forecast 10.2.4 Brazil PCB Plating Equipment Market Forecast 10.3 APAC PCB Plating Equipment Forecast by Region (2024-2029) 10.3.1 China PCB Plating Equipment Market Forecast 10.3.2 Japan PCB Plating Equipment Market Forecast 10.3.3 Korea PCB Plating Equipment Market Forecast 10.3.4 Southeast Asia PCB Plating Equipment Market Forecast 10.3.5 India PCB Plating Equipment Market Forecast 10.3.6 Australia PCB Plating Equipment Market Forecast 10.4 Europe PCB Plating Equipment Forecast by Country (2024-2029) 10.4.1 Germany PCB Plating Equipment Market Forecast 10.4.2 France PCB Plating Equipment Market Forecast 10.4.3 UK PCB Plating Equipment Market Forecast 10.4.4 Italy PCB Plating Equipment Market Forecast 10.4.5 Russia PCB Plating Equipment Market Forecast 10.5 Middle East & Africa PCB Plating Equipment Forecast by Region (2024-2029) 10.5.1 Egypt PCB Plating Equipment Market Forecast 10.5.2 South Africa PCB Plating Equipment Market Forecast 10.5.3 Israel PCB Plating Equipment Market Forecast 10.5.4 Turkey PCB Plating Equipment Market Forecast 10.5.5 GCC Countries PCB Plating Equipment Market Forecast 10.6 Global PCB Plating Equipment Forecast by Type (2024-2029) 10.7 Global PCB Plating Equipment Forecast by Application (2024-2029) 11 Key Players Analysis 11.1 Atotech 11.1.1 Atotech Company Information 11.1.2 Atotech PCB Plating Equipment Product Offered 11.1.3 Atotech PCB Plating Equipment Revenue, Gross Margin and Market Share (2018-2023) 11.1.4 Atotech Main Business Overview 11.1.5 Atotech Latest Developments 11.2 EEJA 11.2.1 EEJA Company Information 11.2.2 EEJA PCB Plating Equipment Product Offered 11.2.3 EEJA PCB Plating Equipment Revenue, Gross Margin and Market Share (2018-2023) 11.2.4 EEJA Main Business Overview 11.2.5 EEJA Latest Developments 11.3 Dongguan UCE Group 11.3.1 Dongguan UCE Group Company Information 11.3.2 Dongguan UCE Group PCB Plating Equipment Product Offered 11.3.3 Dongguan UCE Group PCB Plating Equipment Revenue, Gross Margin and Market Share (2018-2023) 11.3.4 Dongguan UCE Group Main Business Overview 11.3.5 Dongguan UCE Group Latest Developments 11.4 Kunshan Dongwei Technology 11.4.1 Kunshan Dongwei Technology Company Information 11.4.2 Kunshan Dongwei Technology PCB Plating Equipment Product Offered 11.4.3 Kunshan Dongwei Technology PCB Plating Equipment Revenue, Gross Margin and Market Share (2018-2023) 11.4.4 Kunshan Dongwei Technology Main Business Overview 11.4.5 Kunshan Dongwei Technology Latest Developments 11.5 George Koch Sons 11.5.1 George Koch Sons Company Information 11.5.2 George Koch Sons PCB Plating Equipment Product Offered 11.5.3 George Koch Sons PCB Plating Equipment Revenue, Gross Margin and Market Share (2018-2023) 11.5.4 George Koch Sons Main Business Overview 11.5.5 George Koch Sons Latest Developments 11.6 PAT 11.6.1 PAT Company Information 11.6.2 PAT PCB Plating Equipment Product Offered 11.6.3 PAT PCB Plating Equipment Revenue, Gross Margin and Market Share (2018-2023) 11.6.4 PAT Main Business Overview 11.6.5 PAT Latest Developments 11.7 PAL 11.7.1 PAL Company Information 11.7.2 PAL PCB Plating Equipment Product Offered 11.7.3 PAL PCB Plating Equipment Revenue, Gross Margin and Market Share (2018-2023) 11.7.4 PAL Main Business Overview 11.7.5 PAL Latest Developments 11.8 Commend Machinery 11.8.1 Commend Machinery Company Information 11.8.2 Commend Machinery PCB Plating Equipment Product Offered 11.8.3 Commend Machinery PCB Plating Equipment Revenue, Gross Margin and Market Share (2018-2023) 11.8.4 Commend Machinery Main Business Overview 11.8.5 Commend Machinery Latest Developments 11.9 AEL 11.9.1 AEL Company Information 11.9.2 AEL PCB Plating Equipment Product Offered 11.9.3 AEL PCB Plating Equipment Revenue, Gross Margin and Market Share (2018-2023) 11.9.4 AEL Main Business Overview 11.9.5 AEL Latest Developments 11.10 TKC Co., Ltd 11.10.1 TKC Co., Ltd Company Information 11.10.2 TKC Co., Ltd PCB Plating Equipment Product Offered 11.10.3 TKC Co., Ltd PCB Plating Equipment Revenue, Gross Margin and Market Share (2018-2023) 11.10.4 TKC Co., Ltd Main Business Overview 11.10.5 TKC Co., Ltd Latest Developments 11.11 Jastech 11.11.1 Jastech Company Information 11.11.2 Jastech PCB Plating Equipment Product Offered 11.11.3 Jastech PCB Plating Equipment Revenue, Gross Margin and Market Share (2018-2023) 11.11.4 Jastech Main Business Overview 11.11.5 Jastech Latest Developments 11.12 KOVOFINIS 11.12.1 KOVOFINIS Company Information 11.12.2 KOVOFINIS PCB Plating Equipment Product Offered 11.12.3 KOVOFINIS PCB Plating Equipment Revenue, Gross Margin and Market Share (2018-2023) 11.12.4 KOVOFINIS Main Business Overview 11.12.5 KOVOFINIS Latest Developments 11.13 JCU 11.13.1 JCU Company Information 11.13.2 JCU PCB Plating Equipment Product Offered 11.13.3 JCU PCB Plating Equipment Revenue, Gross Margin and Market Share (2018-2023) 11.13.4 JCU Main Business Overview 11.13.5 JCU Latest Developments 11.14 Technic Inc 11.14.1 Technic Inc Company Information 11.14.2 Technic Inc PCB Plating Equipment Product Offered 11.14.3 Technic Inc PCB Plating Equipment Revenue, Gross Margin and Market Share (2018-2023) 11.14.4 Technic Inc Main Business Overview 11.14.5 Technic Inc Latest Developments 11.15 Besi 11.15.1 Besi Company Information 11.15.2 Besi PCB Plating Equipment Product Offered 11.15.3 Besi PCB Plating Equipment Revenue, Gross Margin and Market Share (2018-2023) 11.15.4 Besi Main Business Overview 11.15.5 Besi Latest Developments 11.16 Gangmu Machinery 11.16.1 Gangmu Machinery Company Information 11.16.2 Gangmu Machinery PCB Plating Equipment Product Offered 11.16.3 Gangmu Machinery PCB Plating Equipment Revenue, Gross Margin and Market Share (2018-2023) 11.16.4 Gangmu Machinery Main Business Overview 11.16.5 Gangmu Machinery Latest Developments 12 Research Findings and Conclusion