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Product Code QY09135144884BX
Published Date 2024/6/10
English138 PagesGlobal

Ball Grid Array (BGA) PCB - Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030ElectricComponents_Semiconductor Market


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Product Code QY09135144884BX◆The Jun 2025 edition is also likely available. We will check with the publisher immediately.
Published Date 2024/6/10
English 138 PagesGlobal

Ball Grid Array (BGA) PCB - Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030ElectricComponents_Semiconductor Market



Abstract


Summary

The PCB used for placing the BGA components is known as BGA PCB. It contains similar connections, just like the ball grid array present on the back of the BGA package. The component is placed over the PCB and then soldered. After soldering, the package looks as if it is pasted on the board with glue. There are no leads or connections on the side of the BGA package, and it makes the PCB more reliable and offers many benefits.
The global market for Ball Grid Array (BGA) PCB was estimated to be worth US$ million in 2023 and is forecast to a readjusted size of US$ million by 2030 with a CAGR of % during the forecast period 2024-2030.
According to our Semiconductor Research Center, the global total output value of PCB was about US$ 81 billion in 2022. With strong drivers from new technology, such as AI, 5G and new energy vehicles, it is estimated that the PCB industry will continue to grow steadily in the next six years. Global PCB manufacturers are mainly located in China mainland, China Taiwan, Japan, South Korea, Europe and the United States. Among them, Chinese local PCB companies hold the biggest share.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Ball Grid Array (BGA) PCB, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Ball Grid Array (BGA) PCB by region & country, by Type, and by Application.
The Ball Grid Array (BGA) PCB market size, estimations, and forecasts are provided in terms of sales volume (K Sqm) and sales revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Ball Grid Array (BGA) PCB.
Market Segmentation
By Company
Samsung Electro-Mechanics
Nanya PCB
TTM Technologies Inc.
Unimicron
Shennan Circuits
CMK Corporation
Kingboard
Creative Hi-tech Ltd.
Mer-Mar Electronics
JHYPCB
Multi Circuit Boards Ltd.
PCBAStore
Sierra Circuits
Cirexx
Pcbcart
RayMing
UCREATE ELECTRONIC GROUP
Segment by Type:
Plastic Ball Grid Array
Ceramic Ball Grid Array
Tape Ball Grid Array
Enhanced Ball Grid Array
Flip Chip Ball Grid Array
Micro BGA
Segment by Application
Consumer Electronics
Communications Industrial
Industrial
Others
By Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
U.A.E
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (valve, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of Ball Grid Array (BGA) PCB manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of Ball Grid Array (BGA) PCB in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of Ball Grid Array (BGA) PCB in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.

Table of Contents

  • 1 Market Overview

    • 1.1 Ball Grid Array (BGA) PCB Product Introduction
    • 1.2 Global Ball Grid Array (BGA) PCB Market Size Forecast
      • 1.2.1 Global Ball Grid Array (BGA) PCB Sales Value (2019-2030)
      • 1.2.2 Global Ball Grid Array (BGA) PCB Sales Volume (2019-2030)
      • 1.2.3 Global Ball Grid Array (BGA) PCB Sales Price (2019-2030)
    • 1.3 Ball Grid Array (BGA) PCB Market Trends & Drivers
      • 1.3.1 Ball Grid Array (BGA) PCB Industry Trends
      • 1.3.2 Ball Grid Array (BGA) PCB Market Drivers & Opportunity
      • 1.3.3 Ball Grid Array (BGA) PCB Market Challenges
      • 1.3.4 Ball Grid Array (BGA) PCB Market Restraints
    • 1.4 Assumptions and Limitations
    • 1.5 Study Objectives
    • 1.6 Years Considered
  • 2 Competitive Analysis by Company

    • 2.1 Global Ball Grid Array (BGA) PCB Players Revenue Ranking (2023)
    • 2.2 Global Ball Grid Array (BGA) PCB Revenue by Company (2019-2024)
    • 2.3 Global Ball Grid Array (BGA) PCB Players Sales Volume Ranking (2023)
    • 2.4 Global Ball Grid Array (BGA) PCB Sales Volume by Company Players (2019-2024)
    • 2.5 Global Ball Grid Array (BGA) PCB Average Price by Company (2019-2024)
    • 2.6 Key Manufacturers Ball Grid Array (BGA) PCB Manufacturing Base Distribution and Headquarters
    • 2.7 Key Manufacturers Ball Grid Array (BGA) PCB Product Offered
    • 2.8 Key Manufacturers Time to Begin Mass Production of Ball Grid Array (BGA) PCB
    • 2.9 Ball Grid Array (BGA) PCB Market Competitive Analysis
      • 2.9.1 Ball Grid Array (BGA) PCB Market Concentration Rate (2019-2024)
      • 2.9.2 Global 5 and 10 Largest Manufacturers by Ball Grid Array (BGA) PCB Revenue in 2023
      • 2.9.3 Global Top Manufacturers by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Ball Grid Array (BGA) PCB as of 2023)
    • 2.10 Mergers & Acquisitions, Expansion
  • 3 Segmentation by Type

    • 3.1 Introduction by Type
      • 3.1.1 Plastic Ball Grid Array
      • 3.1.2 Ceramic Ball Grid Array
      • 3.1.3 Tape Ball Grid Array
      • 3.1.4 Enhanced Ball Grid Array
      • 3.1.5 Flip Chip Ball Grid Array
      • 3.1.6 Micro BGA
    • 3.2 Global Ball Grid Array (BGA) PCB Sales Value by Type
      • 3.2.1 Global Ball Grid Array (BGA) PCB Sales Value by Type (2019 VS 2023 VS 2030)
      • 3.2.2 Global Ball Grid Array (BGA) PCB Sales Value, by Type (2019-2030)
      • 3.2.3 Global Ball Grid Array (BGA) PCB Sales Value, by Type (%) (2019-2030)
    • 3.3 Global Ball Grid Array (BGA) PCB Sales Volume by Type
      • 3.3.1 Global Ball Grid Array (BGA) PCB Sales Volume by Type (2019 VS 2023 VS 2030)
      • 3.3.2 Global Ball Grid Array (BGA) PCB Sales Volume, by Type (2019-2030)
      • 3.3.3 Global Ball Grid Array (BGA) PCB Sales Volume, by Type (%) (2019-2030)
    • 3.4 Global Ball Grid Array (BGA) PCB Average Price by Type (2019-2030)
  • 4 Segmentation by Application

    • 4.1 Introduction by Application
      • 4.1.1 Consumer Electronics
      • 4.1.2 Communications Industrial
      • 4.1.3 Industrial
      • 4.1.4 Others
    • 4.2 Global Ball Grid Array (BGA) PCB Sales Value by Application
      • 4.2.1 Global Ball Grid Array (BGA) PCB Sales Value by Application (2019 VS 2023 VS 2030)
      • 4.2.2 Global Ball Grid Array (BGA) PCB Sales Value, by Application (2019-2030)
      • 4.2.3 Global Ball Grid Array (BGA) PCB Sales Value, by Application (%) (2019-2030)
    • 4.3 Global Ball Grid Array (BGA) PCB Sales Volume by Application
      • 4.3.1 Global Ball Grid Array (BGA) PCB Sales Volume by Application (2019 VS 2023 VS 2030)
      • 4.3.2 Global Ball Grid Array (BGA) PCB Sales Volume, by Application (2019-2030)
      • 4.3.3 Global Ball Grid Array (BGA) PCB Sales Volume, by Application (%) (2019-2030)
    • 4.4 Global Ball Grid Array (BGA) PCB Average Price by Application (2019-2030)
  • 5 Segmentation by Region

    • 5.1 Global Ball Grid Array (BGA) PCB Sales Value by Region
      • 5.1.1 Global Ball Grid Array (BGA) PCB Sales Value by Region: 2019 VS 2023 VS 2030
      • 5.1.2 Global Ball Grid Array (BGA) PCB Sales Value by Region (2019-2024)
      • 5.1.3 Global Ball Grid Array (BGA) PCB Sales Value by Region (2025-2030)
      • 5.1.4 Global Ball Grid Array (BGA) PCB Sales Value by Region (%), (2019-2030)
    • 5.2 Global Ball Grid Array (BGA) PCB Sales Volume by Region
      • 5.2.1 Global Ball Grid Array (BGA) PCB Sales Volume by Region: 2019 VS 2023 VS 2030
      • 5.2.2 Global Ball Grid Array (BGA) PCB Sales Volume by Region (2019-2024)
      • 5.2.3 Global Ball Grid Array (BGA) PCB Sales Volume by Region (2025-2030)
      • 5.2.4 Global Ball Grid Array (BGA) PCB Sales Volume by Region (%), (2019-2030)
    • 5.3 Global Ball Grid Array (BGA) PCB Average Price by Region (2019-2030)
    • 5.4 North America
      • 5.4.1 North America Ball Grid Array (BGA) PCB Sales Value, 2019-2030
      • 5.4.2 North America Ball Grid Array (BGA) PCB Sales Value by Country (%), 2023 VS 2030
    • 5.5 Europe
      • 5.5.1 Europe Ball Grid Array (BGA) PCB Sales Value, 2019-2030
      • 5.5.2 Europe Ball Grid Array (BGA) PCB Sales Value by Country (%), 2023 VS 2030
    • 5.6 Asia Pacific
      • 5.6.1 Asia Pacific Ball Grid Array (BGA) PCB Sales Value, 2019-2030
      • 5.6.2 Asia Pacific Ball Grid Array (BGA) PCB Sales Value by Country (%), 2023 VS 2030
    • 5.7 South America
      • 5.7.1 South America Ball Grid Array (BGA) PCB Sales Value, 2019-2030
      • 5.7.2 South America Ball Grid Array (BGA) PCB Sales Value by Country (%), 2023 VS 2030
    • 5.8 Middle East & Africa
      • 5.8.1 Middle East & Africa Ball Grid Array (BGA) PCB Sales Value, 2019-2030
      • 5.8.2 Middle East & Africa Ball Grid Array (BGA) PCB Sales Value by Country (%), 2023 VS 2030
  • 6 Segmentation by Key Countries/Regions

    • 6.1 Key Countries/Regions Ball Grid Array (BGA) PCB Sales Value Growth Trends, 2019 VS 2023 VS 2030
    • 6.2 Key Countries/Regions Ball Grid Array (BGA) PCB Sales Value
      • 6.2.1 Key Countries/Regions Ball Grid Array (BGA) PCB Sales Value, 2019-2030
      • 6.2.2 Key Countries/Regions Ball Grid Array (BGA) PCB Sales Volume, 2019-2030
    • 6.3 United States
      • 6.3.1 United States Ball Grid Array (BGA) PCB Sales Value, 2019-2030
      • 6.3.2 United States Ball Grid Array (BGA) PCB Sales Value by Type (%), 2023 VS 2030
      • 6.3.3 United States Ball Grid Array (BGA) PCB Sales Value by Application, 2023 VS 2030
    • 6.4 Europe
      • 6.4.1 Europe Ball Grid Array (BGA) PCB Sales Value, 2019-2030
      • 6.4.2 Europe Ball Grid Array (BGA) PCB Sales Value by Type (%), 2023 VS 2030
      • 6.4.3 Europe Ball Grid Array (BGA) PCB Sales Value by Application, 2023 VS 2030
    • 6.5 China
      • 6.5.1 China Ball Grid Array (BGA) PCB Sales Value, 2019-2030
      • 6.5.2 China Ball Grid Array (BGA) PCB Sales Value by Type (%), 2023 VS 2030
      • 6.5.3 China Ball Grid Array (BGA) PCB Sales Value by Application, 2023 VS 2030
    • 6.6 Japan
      • 6.6.1 Japan Ball Grid Array (BGA) PCB Sales Value, 2019-2030
      • 6.6.2 Japan Ball Grid Array (BGA) PCB Sales Value by Type (%), 2023 VS 2030
      • 6.6.3 Japan Ball Grid Array (BGA) PCB Sales Value by Application, 2023 VS 2030
    • 6.7 South Korea
      • 6.7.1 South Korea Ball Grid Array (BGA) PCB Sales Value, 2019-2030
      • 6.7.2 South Korea Ball Grid Array (BGA) PCB Sales Value by Type (%), 2023 VS 2030
      • 6.7.3 South Korea Ball Grid Array (BGA) PCB Sales Value by Application, 2023 VS 2030
    • 6.8 Southeast Asia
      • 6.8.1 Southeast Asia Ball Grid Array (BGA) PCB Sales Value, 2019-2030
      • 6.8.2 Southeast Asia Ball Grid Array (BGA) PCB Sales Value by Type (%), 2023 VS 2030
      • 6.8.3 Southeast Asia Ball Grid Array (BGA) PCB Sales Value by Application, 2023 VS 2030
    • 6.9 India
      • 6.9.1 India Ball Grid Array (BGA) PCB Sales Value, 2019-2030
      • 6.9.2 India Ball Grid Array (BGA) PCB Sales Value by Type (%), 2023 VS 2030
      • 6.9.3 India Ball Grid Array (BGA) PCB Sales Value by Application, 2023 VS 2030
  • 7 Company Profiles

    • 7.1 Samsung Electro-Mechanics
      • 7.1.1 Samsung Electro-Mechanics Company Information
      • 7.1.2 Samsung Electro-Mechanics Introduction and Business Overview
      • 7.1.3 Samsung Electro-Mechanics Ball Grid Array (BGA) PCB Sales, Revenue and Gross Margin (2019-2024)
      • 7.1.4 Samsung Electro-Mechanics Ball Grid Array (BGA) PCB Product Offerings
      • 7.1.5 Samsung Electro-Mechanics Recent Development
    • 7.2 Nanya PCB
      • 7.2.1 Nanya PCB Company Information
      • 7.2.2 Nanya PCB Introduction and Business Overview
      • 7.2.3 Nanya PCB Ball Grid Array (BGA) PCB Sales, Revenue and Gross Margin (2019-2024)
      • 7.2.4 Nanya PCB Ball Grid Array (BGA) PCB Product Offerings
      • 7.2.5 Nanya PCB Recent Development
    • 7.3 TTM Technologies Inc.
      • 7.3.1 TTM Technologies Inc. Company Information
      • 7.3.2 TTM Technologies Inc. Introduction and Business Overview
      • 7.3.3 TTM Technologies Inc. Ball Grid Array (BGA) PCB Sales, Revenue and Gross Margin (2019-2024)
      • 7.3.4 TTM Technologies Inc. Ball Grid Array (BGA) PCB Product Offerings
      • 7.3.5 TTM Technologies Inc. Recent Development
    • 7.4 Unimicron
      • 7.4.1 Unimicron Company Information
      • 7.4.2 Unimicron Introduction and Business Overview
      • 7.4.3 Unimicron Ball Grid Array (BGA) PCB Sales, Revenue and Gross Margin (2019-2024)
      • 7.4.4 Unimicron Ball Grid Array (BGA) PCB Product Offerings
      • 7.4.5 Unimicron Recent Development
    • 7.5 Shennan Circuits
      • 7.5.1 Shennan Circuits Company Information
      • 7.5.2 Shennan Circuits Introduction and Business Overview
      • 7.5.3 Shennan Circuits Ball Grid Array (BGA) PCB Sales, Revenue and Gross Margin (2019-2024)
      • 7.5.4 Shennan Circuits Ball Grid Array (BGA) PCB Product Offerings
      • 7.5.5 Shennan Circuits Recent Development
    • 7.6 CMK Corporation
      • 7.6.1 CMK Corporation Company Information
      • 7.6.2 CMK Corporation Introduction and Business Overview
      • 7.6.3 CMK Corporation Ball Grid Array (BGA) PCB Sales, Revenue and Gross Margin (2019-2024)
      • 7.6.4 CMK Corporation Ball Grid Array (BGA) PCB Product Offerings
      • 7.6.5 CMK Corporation Recent Development
    • 7.7 Kingboard
      • 7.7.1 Kingboard Company Information
      • 7.7.2 Kingboard Introduction and Business Overview
      • 7.7.3 Kingboard Ball Grid Array (BGA) PCB Sales, Revenue and Gross Margin (2019-2024)
      • 7.7.4 Kingboard Ball Grid Array (BGA) PCB Product Offerings
      • 7.7.5 Kingboard Recent Development
    • 7.8 Creative Hi-tech Ltd.
      • 7.8.1 Creative Hi-tech Ltd. Company Information
      • 7.8.2 Creative Hi-tech Ltd. Introduction and Business Overview
      • 7.8.3 Creative Hi-tech Ltd. Ball Grid Array (BGA) PCB Sales, Revenue and Gross Margin (2019-2024)
      • 7.8.4 Creative Hi-tech Ltd. Ball Grid Array (BGA) PCB Product Offerings
      • 7.8.5 Creative Hi-tech Ltd. Recent Development
    • 7.9 Mer-Mar Electronics
      • 7.9.1 Mer-Mar Electronics Company Information
      • 7.9.2 Mer-Mar Electronics Introduction and Business Overview
      • 7.9.3 Mer-Mar Electronics Ball Grid Array (BGA) PCB Sales, Revenue and Gross Margin (2019-2024)
      • 7.9.4 Mer-Mar Electronics Ball Grid Array (BGA) PCB Product Offerings
      • 7.9.5 Mer-Mar Electronics Recent Development
    • 7.10 JHYPCB
      • 7.10.1 JHYPCB Company Information
      • 7.10.2 JHYPCB Introduction and Business Overview
      • 7.10.3 JHYPCB Ball Grid Array (BGA) PCB Sales, Revenue and Gross Margin (2019-2024)
      • 7.10.4 JHYPCB Ball Grid Array (BGA) PCB Product Offerings
      • 7.10.5 JHYPCB Recent Development
    • 7.11 Multi Circuit Boards Ltd.
      • 7.11.1 Multi Circuit Boards Ltd. Company Information
      • 7.11.2 Multi Circuit Boards Ltd. Introduction and Business Overview
      • 7.11.3 Multi Circuit Boards Ltd. Ball Grid Array (BGA) PCB Sales, Revenue and Gross Margin (2019-2024)
      • 7.11.4 Multi Circuit Boards Ltd. Ball Grid Array (BGA) PCB Product Offerings
      • 7.11.5 Multi Circuit Boards Ltd. Recent Development
    • 7.12 PCBAStore
      • 7.12.1 PCBAStore Company Information
      • 7.12.2 PCBAStore Introduction and Business Overview
      • 7.12.3 PCBAStore Ball Grid Array (BGA) PCB Sales, Revenue and Gross Margin (2019-2024)
      • 7.12.4 PCBAStore Ball Grid Array (BGA) PCB Product Offerings
      • 7.12.5 PCBAStore Recent Development
    • 7.13 Sierra Circuits
      • 7.13.1 Sierra Circuits Company Information
      • 7.13.2 Sierra Circuits Introduction and Business Overview
      • 7.13.3 Sierra Circuits Ball Grid Array (BGA) PCB Sales, Revenue and Gross Margin (2019-2024)
      • 7.13.4 Sierra Circuits Ball Grid Array (BGA) PCB Product Offerings
      • 7.13.5 Sierra Circuits Recent Development
    • 7.14 Cirexx
      • 7.14.1 Cirexx Company Information
      • 7.14.2 Cirexx Introduction and Business Overview
      • 7.14.3 Cirexx Ball Grid Array (BGA) PCB Sales, Revenue and Gross Margin (2019-2024)
      • 7.14.4 Cirexx Ball Grid Array (BGA) PCB Product Offerings
      • 7.14.5 Cirexx Recent Development
    • 7.15 Pcbcart
      • 7.15.1 Pcbcart Company Information
      • 7.15.2 Pcbcart Introduction and Business Overview
      • 7.15.3 Pcbcart Ball Grid Array (BGA) PCB Sales, Revenue and Gross Margin (2019-2024)
      • 7.15.4 Pcbcart Ball Grid Array (BGA) PCB Product Offerings
      • 7.15.5 Pcbcart Recent Development
    • 7.16 RayMing
      • 7.16.1 RayMing Company Information
      • 7.16.2 RayMing Introduction and Business Overview
      • 7.16.3 RayMing Ball Grid Array (BGA) PCB Sales, Revenue and Gross Margin (2019-2024)
      • 7.16.4 RayMing Ball Grid Array (BGA) PCB Product Offerings
      • 7.16.5 RayMing Recent Development
    • 7.17 UCREATE ELECTRONIC GROUP
      • 7.17.1 UCREATE ELECTRONIC GROUP Company Information
      • 7.17.2 UCREATE ELECTRONIC GROUP Introduction and Business Overview
      • 7.17.3 UCREATE ELECTRONIC GROUP Ball Grid Array (BGA) PCB Sales, Revenue and Gross Margin (2019-2024)
      • 7.17.4 UCREATE ELECTRONIC GROUP Ball Grid Array (BGA) PCB Product Offerings
      • 7.17.5 UCREATE ELECTRONIC GROUP Recent Development
  • 8 Industry Chain Analysis

    • 8.1 Ball Grid Array (BGA) PCB Industrial Chain
    • 8.2 Ball Grid Array (BGA) PCB Upstream Analysis
      • 8.2.1 Key Raw Materials
      • 8.2.2 Raw Materials Key Suppliers
      • 8.2.3 Manufacturing Cost Structure
    • 8.3 Midstream Analysis
    • 8.4 Downstream Analysis (Customers Analysis)
    • 8.5 Sales Model and Sales Channels
      • 8.5.1 Ball Grid Array (BGA) PCB Sales Model
      • 8.5.2 Sales Channel
      • 8.5.3 Ball Grid Array (BGA) PCB Distributors
  • 9 Research Findings and Conclusion

  • 10 Appendix

    • 10.1 Research Methodology
      • 10.1.1 Methodology/Research Approach
      • 10.1.2 Data Source
    • 10.2 Author Details
    • 10.3 Disclaimer
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