Abstract
Summary
Multichip Package (MCP) defines a packaging option in which multiple die and/or packaged devices (SOICs, CSPs) are incorporated into a single package. The MCP may be considered as an alternative to an Application Specific Integrated Circuit (ASIC). Compared to the ASIC it is a viable option offering lower cost and faster time to market. It presents many advantages providing for a significant increase in packaging efficiency by replacing multiple packages with a single package.
The global market for Multichip Package was estimated to be worth US$ million in 2023 and is forecast to a readjusted size of US$ million by 2030 with a CAGR of % during the forecast period 2024-2030.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Multichip Package, focusing on the total sales revenue, key companies market share and ranking, together with an analysis of Multichip Package by region & country, by Type, and by Application.
The Multichip Package market size, estimations, and forecasts are provided in terms of sales revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Multichip Package.
Market Segmentation
By Company
Micron Technology
Texas Instruments
Cypress Semiconductor Corporation
SK Hynix
ASE
Amkor
Intel
Samsung
AT&S
IBM
UTAC
TSMC
Qorvo
Segment by Type:
HC or HIC
MCMs
3-D Packaging
SiP or SoP
Segment by Application
Consumer Electronics
Industrial
Automotive & Transport
Aerospace & Defense
Others
By Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
UAE
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size. This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of Multichip Package manufacturers competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Revenue of Multichip Package in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Revenue of Multichip Package in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product revenue, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.
The global market for Multichip Package was estimated to be worth US$ million in 2023 and is forecast to a readjusted size of US$ million by 2030 with a CAGR of % during the forecast period 2024-2030.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Multichip Package, focusing on the total sales revenue, key companies market share and ranking, together with an analysis of Multichip Package by region & country, by Type, and by Application.
The Multichip Package market size, estimations, and forecasts are provided in terms of sales revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Multichip Package.
Market Segmentation
By Company
Micron Technology
Texas Instruments
Cypress Semiconductor Corporation
SK Hynix
ASE
Amkor
Intel
Samsung
AT&S
IBM
UTAC
TSMC
Qorvo
Segment by Type:
HC or HIC
MCMs
3-D Packaging
SiP or SoP
Segment by Application
Consumer Electronics
Industrial
Automotive & Transport
Aerospace & Defense
Others
By Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
UAE
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size. This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of Multichip Package manufacturers competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Revenue of Multichip Package in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Revenue of Multichip Package in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product revenue, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.
Table of Contents
1 Market Overview
1.1 Multichip Package Product Introduction
1.2 Global Multichip Package Market Size Forecast
1.3 Multichip Package Market Trends & Drivers
1.3.1 Multichip Package Industry Trends
1.3.2 Multichip Package Market Drivers & Opportunity
1.3.3 Multichip Package Market Challenges
1.3.4 Multichip Package Market Restraints
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Competitive Analysis by Company
2.1 Global Multichip Package Players Revenue Ranking (2023)
2.2 Global Multichip Package Revenue by Company (2019-2024)
2.3 Key Companies Multichip Package Manufacturing Base Distribution and Headquarters
2.4 Key Companies Multichip Package Product Offered
2.5 Key Companies Time to Begin Mass Production of Multichip Package
2.6 Multichip Package Market Competitive Analysis
2.6.1 Multichip Package Market Concentration Rate (2019-2024)
2.6.2 Global 5 and 10 Largest Companies by Multichip Package Revenue in 2023
2.6.3 Global Top Companies by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Multichip Package as of 2023)
2.7 Mergers & Acquisitions, Expansion
3 Segmentation by Type
3.1 Introduction by Type
3.1.1 HC or HIC
3.1.2 MCMs
3.1.3 3-D Packaging
3.1.4 SiP or SoP
3.2 Global Multichip Package Sales Value by Type
3.2.1 Global Multichip Package Sales Value by Type (2019 VS 2023 VS 2030)
3.2.2 Global Multichip Package Sales Value, by Type (2019-2030)
3.2.3 Global Multichip Package Sales Value, by Type (%) (2019-2030)
4 Segmentation by Application
4.1 Introduction by Application
4.1.1 Consumer Electronics
4.1.2 Industrial
4.1.3 Automotive & Transport
4.1.4 Aerospace & Defense
4.1.5 Others
4.2 Global Multichip Package Sales Value by Application
4.2.1 Global Multichip Package Sales Value by Application (2019 VS 2023 VS 2030)
4.2.2 Global Multichip Package Sales Value, by Application (2019-2030)
4.2.3 Global Multichip Package Sales Value, by Application (%) (2019-2030)
5 Segmentation by Region
5.1 Global Multichip Package Sales Value by Region
5.1.1 Global Multichip Package Sales Value by Region: 2019 VS 2023 VS 2030
5.1.2 Global Multichip Package Sales Value by Region (2019-2024)
5.1.3 Global Multichip Package Sales Value by Region (2025-2030)
5.1.4 Global Multichip Package Sales Value by Region (%), (2019-2030)
5.2 North America
5.2.1 North America Multichip Package Sales Value, 2019-2030
5.2.2 North America Multichip Package Sales Value by Country (%), 2023 VS 2030
5.3 Europe
5.3.1 Europe Multichip Package Sales Value, 2019-2030
5.3.2 Europe Multichip Package Sales Value by Country (%), 2023 VS 2030
5.4 Asia Pacific
5.4.1 Asia Pacific Multichip Package Sales Value, 2019-2030
5.4.2 Asia Pacific Multichip Package Sales Value by Country (%), 2023 VS 2030
5.5 South America
5.5.1 South America Multichip Package Sales Value, 2019-2030
5.5.2 South America Multichip Package Sales Value by Country (%), 2023 VS 2030
5.6 Middle East & Africa
5.6.1 Middle East & Africa Multichip Package Sales Value, 2019-2030
5.6.2 Middle East & Africa Multichip Package Sales Value by Country (%), 2023 VS 2030
6 Segmentation by Key Countries/Regions
6.1 Key Countries/Regions Multichip Package Sales Value Growth Trends, 2019 VS 2023 VS 2030
6.2 Key Countries/Regions Multichip Package Sales Value
6.3 United States
6.3.1 United States Multichip Package Sales Value, 2019-2030
6.3.2 United States Multichip Package Sales Value by Type (%), 2023 VS 2030
6.3.3 United States Multichip Package Sales Value by Application, 2023 VS 2030
6.4 Europe
6.4.1 Europe Multichip Package Sales Value, 2019-2030
6.4.2 Europe Multichip Package Sales Value by Type (%), 2023 VS 2030
6.4.3 Europe Multichip Package Sales Value by Application, 2023 VS 2030
6.5 China
6.5.1 China Multichip Package Sales Value, 2019-2030
6.5.2 China Multichip Package Sales Value by Type (%), 2023 VS 2030
6.5.3 China Multichip Package Sales Value by Application, 2023 VS 2030
6.6 Japan
6.6.1 Japan Multichip Package Sales Value, 2019-2030
6.6.2 Japan Multichip Package Sales Value by Type (%), 2023 VS 2030
6.6.3 Japan Multichip Package Sales Value by Application, 2023 VS 2030
6.7 South Korea
6.7.1 South Korea Multichip Package Sales Value, 2019-2030
6.7.2 South Korea Multichip Package Sales Value by Type (%), 2023 VS 2030
6.7.3 South Korea Multichip Package Sales Value by Application, 2023 VS 2030
6.8 Southeast Asia
6.8.1 Southeast Asia Multichip Package Sales Value, 2019-2030
6.8.2 Southeast Asia Multichip Package Sales Value by Type (%), 2023 VS 2030
6.8.3 Southeast Asia Multichip Package Sales Value by Application, 2023 VS 2030
6.9 India
6.9.1 India Multichip Package Sales Value, 2019-2030
6.9.2 India Multichip Package Sales Value by Type (%), 2023 VS 2030
6.9.3 India Multichip Package Sales Value by Application, 2023 VS 2030
7 Company Profiles
7.1 Micron Technology
7.1.1 Micron Technology Profile
7.1.2 Micron Technology Main Business
7.1.3 Micron Technology Multichip Package Products, Services and Solutions
7.1.4 Micron Technology Multichip Package Revenue (US$ Million) & (2019-2024)
7.1.5 Micron Technology Recent Developments
7.2 Texas Instruments
7.2.1 Texas Instruments Profile
7.2.2 Texas Instruments Main Business
7.2.3 Texas Instruments Multichip Package Products, Services and Solutions
7.2.4 Texas Instruments Multichip Package Revenue (US$ Million) & (2019-2024)
7.2.5 Texas Instruments Recent Developments
7.3 Cypress Semiconductor Corporation
7.3.1 Cypress Semiconductor Corporation Profile
7.3.2 Cypress Semiconductor Corporation Main Business
7.3.3 Cypress Semiconductor Corporation Multichip Package Products, Services and Solutions
7.3.4 Cypress Semiconductor Corporation Multichip Package Revenue (US$ Million) & (2019-2024)
7.3.5 SK Hynix Recent Developments
7.4 SK Hynix
7.4.1 SK Hynix Profile
7.4.2 SK Hynix Main Business
7.4.3 SK Hynix Multichip Package Products, Services and Solutions
7.4.4 SK Hynix Multichip Package Revenue (US$ Million) & (2019-2024)
7.4.5 SK Hynix Recent Developments
7.5 ASE
7.5.1 ASE Profile
7.5.2 ASE Main Business
7.5.3 ASE Multichip Package Products, Services and Solutions
7.5.4 ASE Multichip Package Revenue (US$ Million) & (2019-2024)
7.5.5 ASE Recent Developments
7.6 Amkor
7.6.1 Amkor Profile
7.6.2 Amkor Main Business
7.6.3 Amkor Multichip Package Products, Services and Solutions
7.6.4 Amkor Multichip Package Revenue (US$ Million) & (2019-2024)
7.6.5 Amkor Recent Developments
7.7 Intel
7.7.1 Intel Profile
7.7.2 Intel Main Business
7.7.3 Intel Multichip Package Products, Services and Solutions
7.7.4 Intel Multichip Package Revenue (US$ Million) & (2019-2024)
7.7.5 Intel Recent Developments
7.8 Samsung
7.8.1 Samsung Profile
7.8.2 Samsung Main Business
7.8.3 Samsung Multichip Package Products, Services and Solutions
7.8.4 Samsung Multichip Package Revenue (US$ Million) & (2019-2024)
7.8.5 Samsung Recent Developments
7.9 AT&S
7.9.1 AT&S Profile
7.9.2 AT&S Main Business
7.9.3 AT&S Multichip Package Products, Services and Solutions
7.9.4 AT&S Multichip Package Revenue (US$ Million) & (2019-2024)
7.9.5 AT&S Recent Developments
7.10 IBM
7.10.1 IBM Profile
7.10.2 IBM Main Business
7.10.3 IBM Multichip Package Products, Services and Solutions
7.10.4 IBM Multichip Package Revenue (US$ Million) & (2019-2024)
7.10.5 IBM Recent Developments
7.11 UTAC
7.11.1 UTAC Profile
7.11.2 UTAC Main Business
7.11.3 UTAC Multichip Package Products, Services and Solutions
7.11.4 UTAC Multichip Package Revenue (US$ Million) & (2019-2024)
7.11.5 UTAC Recent Developments
7.12 TSMC
7.12.1 TSMC Profile
7.12.2 TSMC Main Business
7.12.3 TSMC Multichip Package Products, Services and Solutions
7.12.4 TSMC Multichip Package Revenue (US$ Million) & (2019-2024)
7.12.5 TSMC Recent Developments
7.13 Qorvo
7.13.1 Qorvo Profile
7.13.2 Qorvo Main Business
7.13.3 Qorvo Multichip Package Products, Services and Solutions
7.13.4 Qorvo Multichip Package Revenue (US$ Million) & (2019-2024)
7.13.5 Qorvo Recent Developments
8 Industry Chain Analysis
8.1 Multichip Package Industrial Chain
8.2 Multichip Package Upstream Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.2.3 Manufacturing Cost Structure
8.3 Midstream Analysis
8.4 Downstream Analysis (Customers Analysis)
8.5 Sales Model and Sales Channels
8.5.1 Multichip Package Sales Model
8.5.2 Sales Channel
8.5.3 Multichip Package Distributors
9 Research Findings and Conclusion
10 Appendix
10.1 Research Methodology
10.1.1 Methodology/Research Approach
10.1.2 Data Source
10.2 Author Details
10.3 Disclaimer