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商品コード MM0914107489AU
出版日 2024/3/21
MarketsandMarkets
英文233 ページグローバル

シリコンカーバイド(SiC)市場 - デバイス別、ウェハーサイズ別、最終用途別、材料別、結晶構造別、地域別:世界市場規模・市場予測レポート(〜2029年)

Silicon Carbide Market by Device (SiC Discrete Device, SiC Module), Wafer Size (Up to 150mm, >150mm), End-use Application (Automotive, Energy & Power, Industrial, Transportation), Material, Crystal Structure and Region - Global Forecast to 2029


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商品コード MM0914107489AU◆2025年3月版も出版されている時期ですので、お問い合わせ後すぐに確認いたします。
出版日 2024/3/21
MarketsandMarkets
英文 233 ページグローバル

シリコンカーバイド(SiC)市場 - デバイス別、ウェハーサイズ別、最終用途別、材料別、結晶構造別、地域別:世界市場規模・市場予測レポート(〜2029年)

Silicon Carbide Market by Device (SiC Discrete Device, SiC Module), Wafer Size (Up to 150mm, >150mm), End-use Application (Automotive, Energy & Power, Industrial, Transportation), Material, Crystal Structure and Region - Global Forecast to 2029



全体要約

シリコンカーバイド市場は、2024年に42億XX米ドルから2029年には172億XX米ドルに達し、年平均成長率(CAGR)は32.6%と予測されています。この成長の主な要因は、パワーエレクトロニクス需要の増加、再生可能エネルギーシステムの需要の急増、シリコンカーバイドデバイスの採用を促進する取り組みや投資の増加です。特に、150mm超のウエハサイズセグメントが最も高いCAGRを示すと予測されています。

アジア太平洋地域は、シリコンカーバイド市場で最も高いCAGRを記録すると期待されています。この地域では、高出力アプリケーションの拡大が進み、多くの企業がシリコンカーバイド半導体デバイスを商業化する機会を得ています。主要企業には、ROHM株式会社や富士電機株式会社、ルネサスエレクトロニクス株式会社、東芝株式会社、TanKeBlue Semiconductor株式会社などがあります。

関連する質問

17.2億ドル(2029年)

32.6%(2024年から2029年)

ROHM Co., Ltd., Fuji Electric Co., Ltd., Renesas Electronics Corporation, Toshiba Corporation, TanKeBlue Semiconductor Co. Ltd., STMicroelectronics N.V., Infineon Technologies AG, Semiconductor Components Industries, LLC, WOLFSPEED, INC.

高電力アプリケーションの需要増加, 再生可能エネルギーシステムの需要急増, SiCデバイスの採用を促進する取り組みと投資の増加


概要

シリコンカーバイド市場は、2024年の42億米ドルから2029年には172億米ドルに達すると予測されており、2024年から2029年にかけて年平均成長率(CAGR)は32.6%です。シリコンカーバイド市場の成長を促進する主な要因には、パワーエレクトロニクスへの需要の増加、再生可能エネルギーシステムへの急激な需要の高まり、SiCデバイスの採用を促進するための取り組みや投資の増加が含まれており、これらは市場のプレイヤーに多くの成長機会を提供することが期待されています。
150 mmセグメントは、予測期間中にシリコンカーバイド市場で最も高いCAGRを示すことが期待されています。
>150 mm ウェーハサイズ市場は、予測期間中に最も高い CAGR を示すことが見込まれています。これらのウェーハは、標準的なシリコンウェーハと比較して 50% 薄いプロファイルであるため、SiC MOSFET や SiC モジュールなどの様々なデバイスで使用されています。これらの SiC ウェーハは、大量生産および高温が要求されるアプリケーション向けに設計されているため、高い熱伝導率、優れたキャリア移動度、並外れた化学的安定性などの素晴らしい特性を備えています。したがって、>150 mm セグメントは予測期間中に最も高い CAGR を記録することが期待されています。
アジア太平洋地域は、予測期間中に炭化ケイ素市場で最も高いCAGRを記録すると予想されています。
地域の高出力アプリケーションの拡大により、アジア太平洋地域におけるパワー半導体デバイスの重要な収益機会が生まれ、さまざまなパワーアプリケーション向けにシリコンカーバイド半導体デバイスを商業化する企業が多数を惹きつけています。この拡大は地域の市場プレーヤーの収益を押し上げます。シリコンカーバイドセクターの主要企業であるROHM株式会社、富士電機株式会社、ルネサスエレクトロニクス株式会社、東芝株式会社、およびTanKeBlue Semiconductor株式会社は、アジア太平洋地域に本社を置いています。したがって、アジア太平洋地域は予測期間中にシリコンカーバイド市場で最も高いCAGRを記録すると予想されます。
シリコンカーバイド市場における主要参加者のプロフィールの内訳
• 会社の種類別: 第1層 – 35%、第2層 – 45%、第3層 – 20%
• 役職タイプ別:Cレベル – 40%、ディレクターレベル – 30%、その他 – 30%
地域別: 北米 – 30%、ヨーロッパ – 20%、アジア太平洋 – 40%、その他の地域 (RoW) – 10%
シリコンカーバイド市場の主要企業は、STMicroelectronics N.V.(スイス)、Infineon Technologies AG(ドイツ)、Semiconductor Components Industries, LLC(米国)、WOLFSPEED, INC.(米国)、およびROHM Co., Ltd.(日本)などです。
リサーチカバレッジ
この報告書は、デバイス、ウェーハサイズ、最終用途アプリケーションおよび地域に基づいてシリコンカーバイド市場をセグメント化し、そのサイズを予測しています。また、市場成長に影響を与える要因、制約、機会、および課題についての包括的なレビューも提供されています。報告書は、市場の定量的側面に加え、定性的側面もカバーしています。
レポートを購入する理由:
このレポートは、市場のリーダーや新規参入者にシリコンカーバイド市場全体および関連セグメントの最も近い推定収益に関する情報を提供します。このレポートは、利害関係者が競争環境を理解し、市場での位置を強化し、適切な市場進出戦略を計画するためのさらなる洞察を得るのに役立ちます。また、このレポートは利害関係者が市場の脈動を理解するのを助け、主要な市場推進要因、制約、機会、及び課題に関する情報を提供します。
この報告書では、以下のポイントについての洞察を提供します。
シリコンカーバイド市場の成長に影響を与える主な要因(パワーエレクトロニクスに対する需要の増加、再生可能エネルギーシステムへの需要の急増、SiCデバイスの採用を促進するための取り組みや投資の増加)、制約(パワーエレクトロニクスのための代替技術の高い効率)、機会(SiC基板とエピタキシの品質に向けた進展)、および課題(SiCデバイスの材料欠陥、設計およびパッケージングの問題)についての分析です。
• 製品開発/イノベーション:シリコンカーバイド市場における今後の技術、研究開発活動、および新製品の発表に関する詳細な洞察。
市場開発:利益性の高い市場に関する包括的な情報 - 報告書はさまざまな地域における炭化ケイ素市場を分析しています。
• 市場の多様化:シリコンカーバイド市場の新製品、未開拓地域、最近の開発、および投資に関する詳細情報
• 競争評価:STMicroelectronics N.V.(スイス)、Infineon Technologies AG(ドイツ)、Semiconductor Components Industries, LLC(米国)、WOLFSPEED, INC.(米国)、およびROHM株式会社(日本)などの主要プレイヤーの市場シェア、成長戦略、製品提供についての詳細な評価です。

※以下の目次にて、具体的なレポートの構成をご覧頂けます。ご購入、無料サンプルご請求、その他お問い合わせは、ページ上のボタンよりお進みください。

目次

  • 1 イントロダクション 28

    • 1.1 調査の目的 28
    • 1.2 市場の定義 28
    • 1.3 調査範囲 29
      • 1.3.1 包含・除外事項 29
        • 1.3.1.1 企業:包含・除外事項 29
        • 1.3.1.2 デバイス:包含・除外事項 29
        • 1.3.1.3 ウェハーサイズ:包含・除外事項 29
        • 1.3.1.4 バーティカル:包含・除外事項 29
        • 1.3.1.5 地域:包含・除外事項 30
      • 1.3.2 対象市場 30
      • 1.3.3 対象地域 31
      • 1.3.4 対象年 31
    • 1.4 通貨 31
    • 1.5 対象の単位 31
    • 1.6 制約 32
    • 1.7 ステークホルダー 32
    • 1.8 変化のサマリー 32
    • 1.9 不況の影響 32
  • 2 調査手法 33

    • 2.1 リサーチデータ 33
      • 2.1.1 二次データ 34
        • 2.1.1.1 主要二次ソース 34
        • 2.1.1.2 二次情報の主要データ 35
      • 2.1.2 一次データ 35
        • 2.1.2.1 一次インタビュー参加者リスト 36
        • 2.1.2.2 一次ブレークダウン 36
        • 2.1.2.3 業界についての主な考察 36
        • 2.1.2.4 一次情報の主要データ 37
      • 2.1.3 一次調査・二次調査 38
    • 2.2 市場規模予測 39
      • 2.2.1 ボトムアップアプローチ 39
        • 2.2.1.1 ボトムアップ分析(需要側)による市場規模推計の考え方 39
      • 2.2.2 トップダウンアプローチ 40
        • 2.2.2.1 トップダウン分析による市場規模推計の考え方(供給側) 40
    • 2.3 要因分析 41
      • 2.3.1 供給サイド分析 41
    • 2.4 市場成長前提 42
    • 2.5 景気後退がSiC市場に与える影響を分析するために考慮されるパラメータ 43
    • 2.6 データのトライアンギュレーション 44
    • 2.7 調査の前提 45
    • 2.8 リスク評価 45
  • 3 エグゼクティブサマリー 46

  • 4 更なる考察 50

    • 4.1 SiC市場におけるプレーヤーの魅力的な機会 50
    • 4.2 SiC市場、分野別 51
    • 4.3 SiC市場、デバイス別 51
    • 4.4 SiC市場:ウェーハサイズ別 52
    • 4.5 アジア太平洋地域のSiC市場:産業別・国別(2024年 52
  • 5 市場概要 53

    • 5.1 イントロダクション 53
    • 5.2 市場ダイナミクス 53
      • 5.2.1 促進要因 54
        • 5.2.1.1 EVへのSiCデバイス搭載が拡大 54
        • 5.2.1.2 増加するパワーエレクトロニクスの需要 55
        • 5.2.1.3 増加する再生可能エネルギーシステムの需要 55
        • 5.2.1.4 SiCデバイスへの取り組みと投資の増加 56
      • 5.2.2 抑制要因 58
        • 5.2.2.1 パワーエレクトロニクスにおける代替技術の高い有効性 58
        • 5.2.2.2 SiCデバイスの高コスト 58
      • 5.2.3 市場機会 59
        • 5.2.3.1 通信業界におけるSiCデバイスの採用拡大 59
        • 5.2.3.2 SiC基板とエピタキシャル成長プロセスの継続的な品質向上 60
      • 5.2.4 課題 61
        • 5.2.4.1 SiCデバイスの材料欠陥と設計およびパッケージングの問題 61
    • 5.3 サプライチェーン分析 62
    • 5.4 エコシステム分析 64
    • 5.5 投資と資金調達のシナリオ 65
    • 5.6 顧客事業にインパクトのあるトレンド/ディスラプション 65
    • 5.7 技術分析 66
      • 5.7.1 キーテクノロジー 66
        • 5.7.1.1 第4世代SiC 66
        • 5.7.1.2 8インチSiCウェハー 66
      • 5.7.2 補完的テクノロジー 66
        • 5.7.2.1 SiCオンインシュレータ(SiCOI) 66
        • 5.7.2.2 SiC-on-GaN 67
      • 5.7.3 アディショナルテクノロジー 67
        • 5.7.3.1 窒化ガリウム(GaN) 67
        • 5.7.3.2 窒化インジウムガリウム(InGaN) 67
    • 5.8 価格分析 68
      • 5.8.1 主要プレーヤーが提供する製品の平均販売価格 68
      • 5.8.2 SiCデバイスのタイプ別平均販売価格動向 69
      • 5.8.3 SiCデバイスの地域別平均販売価格動向 69
    • 5.9 主なステークホルダーと購入基準 70
      • 5.9.1 購買プロセスにおける主要ステークホルダー 70
      • 5.9.2 購買基準 71
    • 5.10 ポーターのファイブフォース分析 72
      • 5.10.1 新規参入の脅威 73
      • 5.10.2 代替品の脅威 73
      • 5.10.3 サプライヤーの交渉力 73
      • 5.10.4 買い手の交渉力 73
      • 5.10.5 競合・競争状況の激しさ 73
    • 5.11 ケーススタディ分析 74
    • 5.12 取引分析・貿易分析 75
      • 5.12.1 輸入シナリオ 75
      • 5.12.2 輸出シナリオ 76
    • 5.13 特許分析 77
    • 5.14 規制の概観 80
      • 5.14.1 グローバルのスタンダード 80
      • 5.14.2 政府規制 80
        • 5.14.2.1 アジア太平洋 80
        • 5.14.2.2 北米 80
        • 5.14.2.3 ヨーロッパ 81
    • 5.15 主要会議とイベント、2024-2025年 82
  • 6 SiC市場、デバイス別 83

    • 6.1 イントロダクション 84
    • 6.2 SiCディスクリートデバイス 85
      • 6.2.1 EVと5Gインフラにおけるアプリケーションの増加が市場を牽引 85
      • 6.2.2 SiCダイオード 85
      • 6.2.3 SiC MOSFET 86
        • 6.2.3.1 電力スイッチング・トランジスタとして機能し、需要を高める能力 86
    • 6.3 SiCモジュール 90
  • 7 SiC市場:ウェーハサイズ別 94

    • 7.1 イントロダクション 95
    • 7.2 150mmまで 96
      • 7.2.1 高周波機器への普及が市場成長の原動力に 96
    • 7.3 >150mm以上 96
  • 8 SiCデバイスの結晶構造 97

    • 8.1 イントロダクション 97
    • 8.2 閃亜鉛鉱(3c-sic) 97
    • 8.3 ウルツ鉱(4h-sic) 98
    • 8.4 ウルツ鉱(6h-sic) 98
    • 8.5 菱形面体(15r-sic) 98
  • 9 SiC材料の種類 99

    • 9.1 イントロダクション 99
    • 9.2 グリーンSiC 99
    • 9.3 ブラックSiC 99
  • 10 SiC市場、分野別 100

    • 10.1 イントロダクション 101
    • 10.2 自動車 102
      • 10.2.1 高性能光半導体デバイスの需要拡大が需要を押し上げる 102
    • 10.3 エネルギー・電力 104
      • 10.3.1 再生可能エネルギー・システムの急速な普及が需要を加速 104
    • 10.4 産業 105
      • 10.4.1 ロボット分野での利用拡大が需要を押し上げる 105
    • 10.5 輸送・移動 106
    • 10.6 通信 108
      • 10.6.1 5Gワイヤレス通信の普及が市場を牽引 108
    • 10.7 その他 109
  • 11 SiC市場、地域別 110

    • 11.1 イントロダクション 111
    • 11.2 北米 112
      • 11.2.1 北米:リセッション時のインパクト 112
      • 11.2.2 米国 115
        • 11.2.2.1 EVと充電ステーションへの需要の高まりが市場を牽引 115
      • 11.2.3 カナダ 116
      • 11.2.4 メキシコ 117
    • 11.3 ヨーロッパ 118
      • 11.3.1 ヨーロッパ:リセッション時のインパクト 118
      • 11.3.2 英国 121
      • 11.3.3 ドイツ 122
      • 11.3.4 フランス 123
        • 11.3.4.1 市場を牽引する再生可能エネルギーシステムの導入急増 123
      • 11.3.5 その他のヨーロッパ 124
    • 11.4 アジア太平洋 125
      • 11.4.1 アジア太平洋:リセッション時のインパクト 125
      • 11.4.2 中国 128
        • 11.4.2.1 パワーエレクトロニクス産業の隆盛が市場成長を促進 128
      • 11.4.3 日本 129
      • 11.4.4 韓国 130
        • 11.4.4.1 コンシューマー・エレクトロニクスの需要拡大が採用を後押し 130
      • 11.4.5 その他のアジア太平洋 131
    • 11.5 その他地域 132
      • 11.5.1 その他地域:リセッション時のインパクト 132
      • 11.5.2 中東・アフリカ 134
        • 11.5.2.1 再生可能エネルギー・システムの採用拡大が市場を牽引 134
        • 11.5.2.2 GCC地域 134
          • 11.5.2.2.1 半導体産業への投資の増加が需要を押し上げる 134
        • 11.5.2.3 その他の中東・アフリカ 135
      • 11.5.3 南米 136
        • 11.5.3.1 拡大する通信産業が需要を押し上げる 136
  • 12 競合情勢 137

    • 12.1 概要 137
    • 12.2 主要プレイヤーの戦略 <num4>年~<num4>年 137
    • 12.3 MARKET SHARE ANALYSIS, 2023 139
    • 12.4 COMPANY VALUATION AND FINANCIAL METRICS 141
    • 12.5 BRAND/PRODUCT COMPARISON 142
    • 12.6 主要5社の収益分析、2019-2023年 143
    • 12.7 企業評価マトリックス:主要企業 <num4>年 144
      • 12.7.1 STARS 144
      • 12.7.2 EMERGING LEADERS 144
      • 12.7.3 PERVASIVE PLAYERS 144
      • 12.7.4 PARTICIPANTS 144
      • 12.7.5 企業フットプリント:主要企業 <num4>年 146
        • 12.7.5.1 Overall footprint 146
        • 12.7.5.2 Device footprint 147
        • 12.7.5.3 Wafersize footprint 148
        • 12.7.5.4 Application footprint 149
        • 12.7.5.5 Region footprint 150
    • 12.8 企業評価マトリックス:スタートアップ/中小企業 <num4>年 151
      • 12.8.1 PROGRESSIVE COMPANIES 151
      • 12.8.2 RESPONSIVE COMPANIES 151
      • 12.8.3 DYNAMIC COMPANIES 151
      • 12.8.4 STARTING BLOCKS 151
      • 12.8.5 競合ベンチマーキング:スタートアップ/中小企業 <num4>年 153
        • 12.8.5.1 主要新興企業/中小企業のリスト 153
      • 12.8.6 会社のフットプリントSTARTUPS/SMESフットプリント 154
        • 12.8.6.1 Device footprint 154
        • 12.8.6.2 Wafer size footprint 154
        • 12.8.6.3 Application footprint 155
        • 12.8.6.4 Region footprint 155
    • 12.9 競合他社のシナリオと動向 156
      • 12.9.1 製品展開 156
      • 12.9.2 ディール 161
      • 12.9.3 その他 169
  • 13 企業プロファイル 171

    • 13.1 イントロダクション 171
    • 13.2 主要企業 171
      • 13.2.1 STMICROELECTRONICS 171
      • 13.2.2 INFINEON TECHNOLOGIES AG 177
      • 13.2.3 SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC 183
      • 13.2.4 WOLFSPEED, INC 189
      • 13.2.5 ROHM CO., LTD 194
      • 13.2.6 FUJI ELECTRIC CO., LTD 198
      • 13.2.7 TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION 201
      • 13.2.8 MICROCHIP TECHNOLOGY INC 206
      • 13.2.9 MITSUBISHI ELECTRIC CORPORATION 210
      • 13.2.10 COHERENT CORP 214
    • 13.3 他の有力企業 217
      • 13.3.1 HITACHI POWER SEMICONDUCTOR DEVICE, LTD 217
      • 13.3.2 SEMIKRON DANFOSS 218
      • 13.3.3 QORVO, INC 219
      • 13.3.4 GENESIC SEMICONDUCTOR INC 220
      • 13.3.5 TT ELECTRONICS 221
      • 13.3.6 VISHAY INTERTECHNOLOGY, INC 222
      • 13.3.7 WEEN SEMICONDUCTORS 223
      • 13.3.8 SOLITRON DEVICES, INC 224
      • 13.3.9 SANAN IC 224
      • 13.3.10 BYD SEMICONDUCTOR 225
      • 13.3.11 LITTELFUSE, INC 226
      • 13.3.12 TYCO TIANRUN , INC 227
      • 13.3.13 NEXPERIA 228
      • 13.3.14 INVENTCHIP TECHNOLOGY CO., LTD 229
      • 13.3.15 DIODES INCORPORATED 230
  • 14 付録 231

    • 14.1 業界エキスパートの考察 231
    • 14.2 ディスカッションガイド 232
    • 14.3 ナレッジストア 235
    • 14.4 カスタマイズオプション 237
    • 14.5 関連レポート 237
    • 14.6 執筆者の詳細 238

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Description

The silicon carbide market is projected to reach USD 17.2 billion by 2029 from USD 4.2 billion in 2024, at a CAGR of 32.6% from 2024 to 2029. The major factors driving the growth of silicon carbide market includes the increasing demand for power electronics, surging demand for renewable energy systems and growing number of initiatives and investments to encourage the adoption of SiC devices which is expected to provide several growth opportunities for market players in the silicon carbide market. >150 mm segment is expected to witness the highest CAGR in the silicon carbide market during the forecast period The >150 mm wafer size market is poised to exhibit the highest CAGR during the forecast period. These wafers are used across a spectrum of devices such as SiC MOSFETs and SiC modules, due to their 50% thinner profile as compared to standard silicon wafers. As these SiC wafers are engineered for high-volume production and applications that require elevated temperatures, they boast remarkable attributes such as high thermal conductivity, superior carrier mobility, and exceptional chemical stability. Therefore, >150 mm segment is expected to witness the highest CAGR during the forecast period. Asia Pacific is expected to register the highest CAGR in the silicon carbide market during the forecast period The presence of regional expanding scope of high-power applications presents significant revenue opportunities for power semiconductor devices in Asia Pacific, attracting numerous companies to commercialize silicon carbide semiconductor devices for various power applications. This expansion boosts the revenues of regional market players. Leading companies in the silicon carbide sector, such as ROHM Co., Ltd., Fuji Electric Co., Ltd., Renesas Electronics Corporation, Toshiba Corporation, and TanKeBlue Semiconductor Co. Ltd., are headquartered in Asia Pacific. Therefore, Asia Pacific is expected to register the highest CAGR in the silicon carbide market during the forecast period. The break-up of profile of primary participants in the silicon carbide market- • By Company Type: Tier 1 – 35%, Tier 2 – 45%, Tier 3 – 20% • By Designation Type: C Level – 40%, Director Level – 30%, Others – 30% • By Region Type: North America – 30%, Europe – 20%, Asia Pacific – 40%, Rest of the World (RoW) – 10% The major players of silicon carbide market are STMicroelectronics N.V. (Switzerland), Infineon Technologies AG (Germany), Semiconductor Components Industries, LLC (US), WOLFSPEED, INC. (US), and ROHM Co., Ltd. (Japan) among others. Research Coverage The report segments the silicon carbide market and forecasts its size based on device, wafer size, end-use application and region. The report also provides a comprehensive review of drivers, restraints, opportunities, and challenges influencing market growth. The report also covers qualitative aspects in addition to the quantitative aspects of the market. Reasons to buy the report: The report will help the market leaders/new entrants in this market with information on the closest approximate revenues for the overall silicon carbide market and related segments. This report will help stakeholders understand the competitive landscape and gain more insights to strengthen their position in the market and plan suitable go-to-market strategies. The report also helps stakeholders understand the pulse of the market and provides them with information on key market drivers, restraints, opportunities, and challenges. The report provides insights on the following pointers: • Analysis of key drivers (increasing demand for power electronics, surging demand for renewable energy systems, growing number of initiatives and investments to encourage the adoption of SiC devices), restraints (high efficacy of alternative technologies for power electronics), opportunities (ongoing advancements towards the quality of SiC substrate and epitaxy), and challenges (material defects and designing and packaging issues in SiC devices) influencing the growth of the silicon carbide market. • Product Development/Innovation: Detailed insights on upcoming technologies, research & development activities, and new product launches in the silicon carbide market. • Market Development: Comprehensive information about lucrative markets – the report analyses the silicon carbide market across varied regions. • Market Diversification: Exhaustive information about new products, untapped geographies, recent developments, and investments in the silicon carbide market • Competitive Assessment: In-depth assessment of market shares, growth strategies and product offerings of leading players like STMicroelectronics N.V. (Switzerland), Infineon Technologies AG (Germany), Semiconductor Components Industries, LLC (US), WOLFSPEED, INC. (US), and ROHM Co., Ltd. (Japan)

Table of Contents

  • 1 INTRODUCTION 28

    • 1.1 STUDY OBJECTIVES 28
    • 1.2 MARKET DEFINITION 28
    • 1.3 STUDY SCOPE 29
      • 1.3.1 INCLUSIONS AND EXCLUSIONS 29
        • 1.3.1.1 Company: Inclusions and exclusions 29
        • 1.3.1.2 Device: Inclusions and exclusions 29
        • 1.3.1.3 Wafer size: Inclusions and exclusions 29
        • 1.3.1.4 Vertical: Inclusions and exclusions 29
        • 1.3.1.5 Region: Inclusions and exclusions 30
      • 1.3.2 MARKETS COVERED 30
      • 1.3.3 REGIONAL SCOPE 31
      • 1.3.4 YEARS CONSIDERED 31
    • 1.4 CURRENCY CONSIDERED 31
    • 1.5 UNITS CONSIDERED 31
    • 1.6 LIMITATIONS 32
    • 1.7 STAKEHOLDERS 32
    • 1.8 SUMMARY OF CHANGES 32
    • 1.9 IMPACT OF RECESSION 32
  • 2 RESEARCH METHODOLOGY 33

    • 2.1 RESEARCH DATA 33
      • 2.1.1 SECONDARY DATA 34
        • 2.1.1.1 Major secondary sources 34
        • 2.1.1.2 Key data from secondary sources 35
      • 2.1.2 PRIMARY DATA 35
        • 2.1.2.1 List of primary interview participants 36
        • 2.1.2.2 Breakdown of primaries 36
        • 2.1.2.3 Key industry insights 36
        • 2.1.2.4 Key data from primary sources 37
      • 2.1.3 SECONDARY AND PRIMARY RESEARCH 38
    • 2.2 MARKET SIZE ESTIMATION 39
      • 2.2.1 BOTTOM-UP APPROACH 39
        • 2.2.1.1 Approach to estimate market size using bottom-up analysis (demand side) 39
      • 2.2.2 TOP-DOWN APPROACH 40
        • 2.2.2.1 Approach to estimate market size using top-down analysis (supply side) 40
    • 2.3 FACTOR ANALYSIS 41
      • 2.3.1 SUPPLY-SIDE ANALYSIS 41
    • 2.4 MARKET GROWTH ASSUMPTIONS 42
    • 2.5 PARAMETERS CONSIDERED TO ANALYZE IMPACT OF RECESSION ON SIC MARKET 43
    • 2.6 DATA TRIANGULATION 44
    • 2.7 RESEARCH ASSUMPTIONS 45
    • 2.8 RISK ASSESSMENT 45
  • 3 EXECUTIVE SUMMARY 46

  • 4 PREMIUM INSIGHTS 50

    • 4.1 ATTRACTIVE OPPORTUNITIES FOR PLAYERS IN SIC MARKET 50
    • 4.2 SIC MARKET, BY VERTICAL 51
    • 4.3 SIC MARKET, BY DEVICE 51
    • 4.4 SIC MARKET, BY WAFER SIZE 52
    • 4.5 SIC MARKET IN ASIA PACIFIC, BY VERTICAL AND COUNTRY, 2024 52
  • 5 MARKET OVERVIEW 53

    • 5.1 INTRODUCTION 53
    • 5.2 MARKET DYNAMICS 53
      • 5.2.1 DRIVERS 54
        • 5.2.1.1 Growing deployment of SiC devices in EVs 54
        • 5.2.1.2 Increasing demand for power electronics 55
        • 5.2.1.3 Rising demand for renewable energy systems 55
        • 5.2.1.4 Increasing initiatives and investments in SiC devices 56
      • 5.2.2 RESTRAINTS 58
        • 5.2.2.1 High efficacy of alternative technologies for power electronics 58
        • 5.2.2.2 High cost of SiC devices 58
      • 5.2.3 OPPORTUNITIES 59
        • 5.2.3.1 Growing adoption of SiC devices in telecommunications industry 59
        • 5.2.3.2 Ongoing quality enhancements of SiC substrates and epitaxy processes 60
      • 5.2.4 CHALLENGES 61
        • 5.2.4.1 Material defects and designing and packaging issues in SiC devices 61
    • 5.3 SUPPLY CHAIN ANALYSIS 62
    • 5.4 ECOSYSTEM ANALYSIS 64
    • 5.5 INVESTMENT AND FUNDING SCENARIO 65
    • 5.6 TRENDS/DISRUPTIONS IMPACTING CUSTOMERS’ BUSINESSES 65
    • 5.7 TECHNOLOGY ANALYSIS 66
      • 5.7.1 KEY TECHNOLOGIES 66
        • 5.7.1.1 4th Gen SiC 66
        • 5.7.1.2 8-inch SiC wafer 66
      • 5.7.2 COMPLEMENTARY TECHNOLOGIES 66
        • 5.7.2.1 SiC-on-insulator (SiCOI) 66
        • 5.7.2.2 SiC-on-GaN 67
      • 5.7.3 ADJACENT TECHNOLOGIES 67
        • 5.7.3.1 Gallium nitride (GaN) 67
        • 5.7.3.2 Indium gallium nitride (InGaN) 67
    • 5.8 PRICING ANALYSIS 68
      • 5.8.1 AVERAGE SELLING PRICE OF PRODUCTS OFFERED BY KEY PLAYERS 68
      • 5.8.2 AVERAGE SELLING PRICE TREND OF SIC DEVICES, BY TYPE 69
      • 5.8.3 AVERAGE SELLING PRICE TREND OF SIC DEVICES, BY REGION 69
    • 5.9 KEY STAKEHOLDERS AND BUYING CRITERIA 70
      • 5.9.1 KEY STAKEHOLDERS IN BUYING PROCESS 70
      • 5.9.2 BUYING CRITERIA 71
    • 5.10 PORTER’S FIVE FORCES ANALYSIS 72
      • 5.10.1 THREAT OF NEW ENTRANTS 73
      • 5.10.2 THREAT OF SUBSTITUTES 73
      • 5.10.3 BARGAINING POWER OF SUPPLIERS 73
      • 5.10.4 BARGAINING POWER OF BUYERS 73
      • 5.10.5 INTENSITY OF COMPETITIVE RIVALRY 73
    • 5.11 CASE STUDY ANALYSIS 74
      • 5.11.1 JAGUAR LAND ROVER INTEGRATED WOLFSPEED’S SIC DEVICES INTO EVS TO ENHANCE POWERTRAIN EFFICIENCY AND EXTEND DRIVING RANGE 74
      • 5.11.2 BORGWARNER INC. DELIVERED INNOVATIVE AND SUSTAINABLE MOBILITY SOLUTIONS THROUGH INTEGRATION OF STMICROELECTRONICS’ SIC MOSFETS 74
      • 5.11.3 AMPT’S DC STRING ENHANCED OPTIMIZERS BY INTEGRATING ONSEMI’S SIC MOSFET 74
      • 5.11.4 DRIVING PERFORMANCE AND COST EFFICIENCY OF MERSEN’S SIC POWER STACK REFERENCE DESIGN 75
    • 5.12 TRADE ANALYSIS 75
      • 5.12.1 IMPORT SCENARIO 75
      • 5.12.2 EXPORT SCENARIO 76
    • 5.13 PATENT ANALYSIS 77
    • 5.14 REGULATORY LANDSCAPE 80
      • 5.14.1 GLOBAL STANDARDS 80
      • 5.14.2 GOVERNMENT REGULATIONS 80
        • 5.14.2.1 Asia Pacific 80
        • 5.14.2.2 North America 80
        • 5.14.2.3 Europe 81
    • 5.15 KEY CONFERENCES AND EVENTS, 2024-2025 82
  • 6 SIC MARKET, BY DEVICE 83

    • 6.1 INTRODUCTION 84
    • 6.2 SIC DISCRETE DEVICES 85
      • 6.2.1 INCREASING APPLICATIONS IN EVS AND 5G INFRASTRUCTURE TO DRIVE MARKET 85
      • 6.2.2 SIC DIODES 85
        • 6.2.2.1 Higher electrical and thermal conductivity than silicon variants to boost demand 85
      • 6.2.3 SIC MOSFETS 86
        • 6.2.3.1 Ability to function as power-switching transistors to boost demand 86
    • 6.3 SIC MODULES 90
      • 6.3.1 REDUCED NEED FOR PASSIVE COMPONENTS AND SMALL SYSTEM FOOTPRINT TO ACCELERATE DEMAND 90
  • 7 SIC MARKET, BY WAFER SIZE 94

    • 7.1 INTRODUCTION 95
    • 7.2 UP TO 150 MM 96
      • 7.2.1 GROWING DEPLOYMENT IN HIGH-FREQUENCY DEVICES TO FUEL MARKET GROWTH 96
    • 7.3 >150 MM 96
      • 7.3.1 ABILITY TO OFFER LARGE NUMBER OF DEVICES ON SINGLE WAFER TO DRIVE MARKET 96
  • 8 CRYSTAL STRUCTURES OF SIC DEVICES 97

    • 8.1 INTRODUCTION 97
    • 8.2 ZINC BLENDE (3C-SIC) 97
    • 8.3 WURTZITE (4H-SIC) 98
    • 8.4 WURTZITE (6H-SIC) 98
    • 8.5 RHOMBOHEDRAL (15R-SIC) 98
  • 9 SIC MATERIAL TYPES 99

    • 9.1 INTRODUCTION 99
    • 9.2 GREEN SIC 99
    • 9.3 BLACK SIC 99
  • 10 SIC MARKET, BY VERTICAL 100

    • 10.1 INTRODUCTION 101
    • 10.2 AUTOMOTIVE 102
      • 10.2.1 GROWING DEMAND FOR HIGH-PERFORMING OPTO-SEMICONDUCTOR DEVICES TO BOOST DEMAND 102
    • 10.3 ENERGY & POWER 104
      • 10.3.1 RAPID ADOPTION IN RENEWABLE ENERGY SYSTEMS TO ACCELERATE DEMAND 104
    • 10.4 INDUSTRIAL 105
      • 10.4.1 GROWING USE IN ROBOTICS TO BOOST DEMAND 105
    • 10.5 TRANSPORTATION 106
      • 10.5.1 EASE OF HEAT DISSIPATION DUE TO HIGH THERMAL CONDUCTIVITY TO DRIVE MARKET 106
      • 10.5.2 CHARGING STATIONS 106
        • 10.5.2.1 Fast charging with high power density to drive market 106
      • 10.5.3 RAILS 107
        • 10.5.3.1 Reduced power losses within rail modules to accelerate demand 107
    • 10.6 TELECOMMUNICATIONS 108
      • 10.6.1 RISING ADOPTION IN 5G WIRELESS COMMUNICATION TO DRIVE MARKET 108
    • 10.7 OTHERS 109
  • 11 SIC MARKET, BY REGION 110

    • 11.1 INTRODUCTION 111
    • 11.2 NORTH AMERICA 112
      • 11.2.1 NORTH AMERICA: RECESSION IMPACT 112
      • 11.2.2 US 115
        • 11.2.2.1 Growing demand for EVs and charging stations to drive market 115
      • 11.2.3 CANADA 116
        • 11.2.3.1 Government initiatives toward clean technology to increase demand for EVs and drive market 116
      • 11.2.4 MEXICO 117
        • 11.2.4.1 Increasing number of manufacturing facilities and expanding distribution network of SiC device manufacturers to drive market 117
    • 11.3 EUROPE 118
      • 11.3.1 EUROPE: RECESSION IMPACT 118
      • 11.3.2 UK 121
        • 11.3.2.1 Growing adoption of connected and autonomous vehicles (CAVs) to drive market 121
      • 11.3.3 GERMANY 122
        • 11.3.3.1 Increasing applications in power supplies, EV motor drives, and charging stations to drive market 122
      • 11.3.4 FRANCE 123
        • 11.3.4.1 Surging adoption of renewable energy systems to drive market 123
      • 11.3.5 REST OF EUROPE 124
    • 11.4 ASIA PACIFIC 125
      • 11.4.1 ASIA PACIFIC: RECESSION IMPACT 125
      • 11.4.2 CHINA 128
        • 11.4.2.1 Thriving power electronics industry to fuel market growth 128
      • 11.4.3 JAPAN 129
        • 11.4.3.1 Increased R&D activities in industrial, automotive, and telecommunications verticals to boost demand 129
      • 11.4.4 SOUTH KOREA 130
        • 11.4.4.1 Growing demand for consumer electronics to drive adoption 130
      • 11.4.5 REST OF ASIA PACIFIC 131
    • 11.5 ROW 132
      • 11.5.1 ROW: RECESSION IMPACT 132
      • 11.5.2 MIDDLE EAST & AFRICA 134
        • 11.5.2.1 Increasing adoption in renewable energy systems to drive market 134
        • 11.5.2.2 GCC Countries 134
          • 11.5.2.2.1 Increasing investments in semiconductor industry to boost demand 134
        • 11.5.2.3 Rest of Middle East & Africa 135
      • 11.5.3 SOUTH AMERICA 136
        • 11.5.3.1 Expanding telecommunications industry to boost demand 136
  • 12 COMPETITIVE LANDSCAPE 137

    • 12.1 OVERVIEW 137
    • 12.2 STRATEGIES ADOPTED BY KEY PLAYERS, 2020-2024 137
    • 12.3 MARKET SHARE ANALYSIS, 2023 139
    • 12.4 COMPANY VALUATION AND FINANCIAL METRICS 141
    • 12.5 BRAND/PRODUCT COMPARISON 142
    • 12.6 REVENUE ANALYSIS OF FIVE KEY PLAYERS, 2019-2023 143
    • 12.7 COMPANY EVALUATION MATRIX: KEY PLAYERS, 2023 144
      • 12.7.1 STARS 144
      • 12.7.2 EMERGING LEADERS 144
      • 12.7.3 PERVASIVE PLAYERS 144
      • 12.7.4 PARTICIPANTS 144
      • 12.7.5 COMPANY FOOTPRINT: KEY PLAYERS, 2023 146
        • 12.7.5.1 Overall footprint 146
        • 12.7.5.2 Device footprint 147
        • 12.7.5.3 Wafersize footprint 148
        • 12.7.5.4 Application footprint 149
        • 12.7.5.5 Region footprint 150
    • 12.8 COMPANY EVALUATION MATRIX: STARTUPS/SMES, 2023 151
      • 12.8.1 PROGRESSIVE COMPANIES 151
      • 12.8.2 RESPONSIVE COMPANIES 151
      • 12.8.3 DYNAMIC COMPANIES 151
      • 12.8.4 STARTING BLOCKS 151
      • 12.8.5 COMPETITIVE BENCHMARKING: STARTUPS/SMES, 2023 153
        • 12.8.5.1 List of key startups/SMEs 153
      • 12.8.6 COMPANY FOOTPRINT: STARTUPS/SMES FOOTPRINT 154
        • 12.8.6.1 Device footprint 154
        • 12.8.6.2 Wafer size footprint 154
        • 12.8.6.3 Application footprint 155
        • 12.8.6.4 Region footprint 155
    • 12.9 COMPETITIVE SCENARIOS AND TRENDS 156
      • 12.9.1 PRODUCT LAUNCHES 156
      • 12.9.2 DEALS 161
      • 12.9.3 OTHERS 169
  • 13 COMPANY PROFILES 171

    • 13.1 INTRODUCTION 171
    • 13.2 KEY PLAYERS 171
      • 13.2.1 STMICROELECTRONICS 171
      • 13.2.2 INFINEON TECHNOLOGIES AG 177
      • 13.2.3 SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC 183
      • 13.2.4 WOLFSPEED, INC 189
      • 13.2.5 ROHM CO., LTD 194
      • 13.2.6 FUJI ELECTRIC CO., LTD 198
      • 13.2.7 TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION 201
      • 13.2.8 MICROCHIP TECHNOLOGY INC 206
      • 13.2.9 MITSUBISHI ELECTRIC CORPORATION 210
      • 13.2.10 COHERENT CORP 214
    • 13.3 OTHER PLAYERS 217
      • 13.3.1 HITACHI POWER SEMICONDUCTOR DEVICE, LTD 217
      • 13.3.2 SEMIKRON DANFOSS 218
      • 13.3.3 QORVO, INC 219
      • 13.3.4 GENESIC SEMICONDUCTOR INC 220
      • 13.3.5 TT ELECTRONICS 221
      • 13.3.6 VISHAY INTERTECHNOLOGY, INC 222
      • 13.3.7 WEEN SEMICONDUCTORS 223
      • 13.3.8 SOLITRON DEVICES, INC 224
      • 13.3.9 SANAN IC 224
      • 13.3.10 BYD SEMICONDUCTOR 225
      • 13.3.11 LITTELFUSE, INC 226
      • 13.3.12 TYCO TIANRUN , INC 227
      • 13.3.13 NEXPERIA 228
      • 13.3.14 INVENTCHIP TECHNOLOGY CO., LTD 229
      • 13.3.15 DIODES INCORPORATED 230
  • 14 APPENDIX 231

    • 14.1 INSIGHTS FROM INDUSTRY EXPERTS 231
    • 14.2 DISCUSSION GUIDE 232
    • 14.3 KNOWLEDGESTORE: MARKETSANDMARKETS’ SUBSCRIPTION PORTAL 235
    • 14.4 CUSTOMIZATION OPTIONS 237
    • 14.5 RELATED REPORTS 237
    • 14.6 AUTHOR DETAILS 238

TABLE 1 SIC MARKET: GROWTH ASSUMPTIONS TABLE 2 SIC MARKET: SUPPLY CHAIN ANALYSIS TABLE 3 AVERAGE SELLING PRICE OF SIC MOSFETS, SIC DIODES, AND SIC MODULES OFFERED BY KEY PLAYERS TABLE 4 INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS OF TOP THREE VERTICALS TABLE 5 KEY BUYING CRITERIA FOR TOP THREE VERTICALS TABLE 6 SIC MARKET: PORTER’S FIVE FORCES ANALYSIS TABLE 7 IMPORT DATA FOR HS CODE 284920-COMPLIANT PRODUCTS, BY COUNTRY, 2018-2022 (USD MILLION) TABLE 8 EXPORT DATA FOR HS CODE 284920- COMPLIANT PRODUCTS, BY COUNTRY, 2018-2022 (USD MILLION) TABLE 9 NUMBER OF PATENTS GRANTED, JANUARY 2013-DECEMBER 2023 TABLE 10 TOP 20 PATENT OWNERS IN LAST 10 YEARS TABLE 11 MAJOR PATENTS RELATED TO SIC DEVICES TABLE 12 SIC MARKET: KEY CONFERENCES AND EVENTS, 2024-2025 TABLE 13 SIC MARKET, BY DEVICE, 2020-2023 (USD MILLION) TABLE 14 SIC MARKET, BY DEVICE, 2024-2029 (USD MILLION) TABLE 15 SIC DISCRETE DEVICES: SIC MARKET, BY TYPE, 2020-2023 (USD MILLION) TABLE 16 SIC DISCRETE DEVICES: SIC MARKET, BY TYPE, 2024-2029 (USD MILLION) TABLE 17 SIC DISCRETE DEVICES: SIC MARKET, BY TYPE, 2020-2023 (MILLION UNITS) TABLE 18 SIC DISCRETE DEVICES: SIC MARKET, BY TYPE, 2024-2029 (MILLION UNITS) TABLE 19 SIC DISCRETE DEVICES: SIC MARKET, BY REGION, 2020-2023 (USD MILLION) TABLE 20 SIC DISCRETE DEVICES: SIC MARKET, BY REGION, 2024-2029 (USD MILLION) TABLE 21 SIC DISCRETE DEVICES: SIC MARKET IN ASIA PACIFIC, BY COUNTRY, 2020-2023 (USD MILLION) TABLE 22 SIC DISCRETE DEVICES: SIC MARKET IN ASIA PACIFIC, BY COUNTRY, 2024-2029 (USD MILLION) TABLE 23 SIC DISCRETE DEVICES: SIC MARKET IN EUROPE, BY COUNTRY, 2020-2023 (USD MILLION) TABLE 24 SIC DISCRETE DEVICES: SIC MARKET IN EUROPE, BY COUNTRY, 2024-2029 (USD MILLION) TABLE 25 SIC DISCRETE DEVICES: SIC MARKET IN NORTH AMERICA, BY COUNTRY, 2020-2023 (USD MILLION) TABLE 26 SIC DISCRETE DEVICES: SIC MARKET IN NORTH AMERICA, BY COUNTRY, 2024-2029 (USD MILLION) TABLE 27 SIC DISCRETE DEVICES: SIC MARKET IN ROW, BY REGION, 2020-2023 (USD MILLION) TABLE 28 SIC DISCRETE DEVICES: SIC MARKET IN ROW, BY REGION, 2024-2029 (USD MILLION) TABLE 29 SIC MODULES: SIC MARKET, BY REGION, 2020-2023 (USD MILLION) TABLE 30 SIC MODULES: SIC MARKET, BY REGION, 2024-2029 (USD MILLION) TABLE 31 SIC MODULES: SIC MARKET IN ASIA PACIFIC, BY COUNTRY, 2020-2023 (USD MILLION) TABLE 32 SIC MODULES: SIC MARKET IN ASIA PACIFIC, BY COUNTRY, 2024-2029 (USD MILLION) TABLE 33 SIC MODULES: SIC MARKET IN EUROPE, BY COUNTRY, 2020-2023 (USD MILLION) TABLE 34 SIC MODULES: SIC MARKET IN EUROPE, BY COUNTRY, 2024-2029 (USD MILLION) TABLE 35 SIC MODULES: SIC MARKET IN NORTH AMERICA, BY COUNTRY, 2020-2023 (USD MILLION) TABLE 36 SIC MODULES: SIC MARKET IN NORTH AMERICA, BY COUNTRY, 2024-2029 (USD MILLION) TABLE 37 SIC MODULES: SIC MARKET IN ROW, BY REGION, 2020-2023 (USD MILLION) TABLE 38 SIC MODULES: SIC MARKET IN ROW, BY REGION, 2024-2029 (USD MILLION) TABLE 39 SIC MARKET, BY WAFER SIZE, 2020-2023 (USD MILLION) TABLE 40 SIC MARKET, BY WAFER SIZE, 2024-2029 (USD MILLION) TABLE 41 SIC MARKET, BY VERTICAL, 2020-2023 (USD MILLION) TABLE 42 SIC MARKET, BY VERTICAL, 2024-2029 (USD MILLION) TABLE 43 AUTOMOTIVE: SIC MARKET, BY REGION, 2020-2023 (USD MILLION) TABLE 44 AUTOMOTIVE: SIC MARKET, BY REGION, 2024-2029 (USD MILLION) TABLE 45 ENERGY & POWER: SIC MARKET, BY REGION, 2020-2023 (USD MILLION) TABLE 46 ENERGY & POWER: SIC MARKET, BY REGION, 2024-2029 (USD MILLION) TABLE 47 INDUSTRIAL: SIC MARKET, BY REGION, 2020-2023 (USD MILLION) TABLE 48 INDUSTRIAL: SIC MARKET, BY REGION, 2024-2029 (USD MILLION) TABLE 49 TRANSPORTATION: SIC MARKET, BY REGION, 2020-2023 (USD MILLION) TABLE 50 TRANSPORTATION: SIC MARKET, BY REGION, 2024-2029 (USD MILLION) TABLE 51 TELECOMMUNICATIONS: SIC MARKET, BY REGION, 2020-2023 (USD MILLION) TABLE 52 TELECOMMUNICATIONS: SIC MARKET, BY REGION, 2024-2029 (USD MILLION) TABLE 53 OTHERS: SIC MARKET, BY REGION, 2020-2023 (USD MILLION) TABLE 54 OTHERS: SIC MARKET, BY REGION, 2024-2029 (USD MILLION) TABLE 55 SIC MARKET, BY REGION, 2020-2023 (USD MILLION) TABLE 56 SIC MARKET, BY REGION, 2024-2029 (USD MILLION) TABLE 57 NORTH AMERICA: SIC MARKET, BY COUNTRY, 2020-2023 (USD MILLION) TABLE 58 NORTH AMERICA: SIC MARKET, BY COUNTRY, 2024-2029 (USD MILLION) TABLE 59 NORTH AMERICA: SIC MARKET, BY VERTICAL, 2020-2023 (USD MILLION) TABLE 60 NORTH AMERICA: SIC MARKET, BY VERTICAL, 2024-2029 (USD MILLION) TABLE 61 NORTH AMERICA: SIC MARKET, BY DEVICE, 2020-2023 (USD MILLION) TABLE 62 NORTH AMERICA: SIC MARKET, BY DEVICE, 2024-2029 (USD MILLION) TABLE 63 US: SIC MARKET, BY DEVICE, 2020-2023 (USD MILLION) TABLE 64 US: SIC MARKET, BY DEVICE, 2024-2029 (USD MILLION) TABLE 65 CANADA: SIC MARKET, BY DEVICE, 2020-2023 (USD MILLION) TABLE 66 CANADA: SIC MARKET, BY DEVICE, 2024-2029 (USD MILLION) TABLE 67 MEXICO: SIC MARKET, BY DEVICE, 2020-2023 (USD MILLION) TABLE 68 MEXICO: SIC MARKET, BY DEVICE, 2024-2029 (USD MILLION) TABLE 69 EUROPE: SIC MARKET, BY COUNTRY, 2020-2023 (USD MILLION) TABLE 70 EUROPE: SIC MARKET, BY COUNTRY, 2024-2029 (USD MILLION) TABLE 71 EUROPE: SIC MARKET, BY VERTICAL, 2020-2023 (USD MILLION) TABLE 72 EUROPE: SIC MARKET, BY VERTICAL, 2024-2029 (USD MILLION) TABLE 73 EUROPE: SIC MARKET, BY DEVICE, 2020-2023 (USD MILLION) TABLE 74 EUROPE: SIC MARKET, BY DEVICE, 2024-2029 (USD MILLION) TABLE 75 UK: SIC MARKET, BY DEVICE, 2020-2023 (USD MILLION) TABLE 76 UK: SIC MARKET, BY DEVICE, 2024-2029 (USD MILLION) TABLE 77 GERMANY: SIC MARKET, BY DEVICE, 2020-2023 (USD MILLION) TABLE 78 GERMANY: SIC MARKET, BY DEVICE, 2024-2029 (USD MILLION) TABLE 79 FRANCE: SIC MARKET, BY DEVICE, 2020-2023 (USD MILLION) TABLE 80 FRANCE: SIC MARKET, BY DEVICE, 2024-2029 (USD MILLION) TABLE 81 REST OF EUROPE: SIC MARKET, BY DEVICE, 2020-2023 (USD MILLION) TABLE 82 REST OF EUROPE: SIC MARKET, BY DEVICE, 2024-2029 (USD MILLION) TABLE 83 ASIA PACIFIC: SIC MARKET, BY COUNTRY, 2020-2023 (USD MILLION) TABLE 84 ASIA PACIFIC: SIC MARKET, BY COUNTRY, 2024-2029 (USD MILLION) TABLE 85 ASIA PACIFIC: SIC MARKET, BY VERTICAL, 2020-2023 (USD MILLION) TABLE 86 ASIA PACIFIC: SIC MARKET, BY VERTICAL, 2024-2029 (USD MILLION) TABLE 87 ASIA PACIFIC: SIC MARKET, BY DEVICE, 2020-2023 (USD MILLION) TABLE 88 ASIA PACIFIC: SIC MARKET, BY DEVICE, 2024-2029 (USD MILLION) TABLE 89 CHINA: SIC MARKET, BY DEVICE, 2020-2023 (USD MILLION) TABLE 90 CHINA: SIC MARKET, BY DEVICE, 2024-2029 (USD MILLION) TABLE 91 JAPAN: SIC MARKET, BY DEVICE, 2020-2023 (USD MILLION) TABLE 92 JAPAN: SIC MARKET, BY DEVICE, 2024-2029 (USD MILLION) TABLE 93 SOUTH KOREA: SIC MARKET, BY DEVICE, 2020-2023 (USD MILLION) TABLE 94 SOUTH KOREA: SIC MARKET, BY DEVICE, 2024-2029 (USD MILLION) TABLE 95 REST OF ASIA PACIFIC: SIC MARKET, BY DEVICE, 2020-2023 (USD MILLION) TABLE 96 REST OF ASIA PACIFIC: SIC MARKET, BY DEVICE, 2024-2029 (USD MILLION) TABLE 97 ROW: SIC MARKET, BY REGION, 2020-2023 (USD MILLION) TABLE 98 ROW: SIC MARKET, BY REGION, 2024-2029 (USD MILLION) TABLE 99 ROW: SIC MARKET, BY VERTICAL, 2020-2023 (USD MILLION) TABLE 100 ROW: SIC MARKET, BY VERTICAL, 2024-2029 (USD MILLION) TABLE 101 ROW: SIC MARKET, BY DEVICE, 2020-2023 (USD MILLION) TABLE 102 ROW: SIC MARKET, BY DEVICE, 2024-2029 (USD MILLION) TABLE 103 MIDDLE EAST & AFRICA: SIC MARKET, BY REGION, 2020-2023 (USD MILLION) TABLE 104 MIDDLE EAST & AFRICA: SIC MARKET, BY REGION, 2024-2029 (USD MILLION) TABLE 105 MIDDLE EAST & AFRICA: SIC MARKET, BY DEVICE, 2020-2023 (USD MILLION) TABLE 106 MIDDLE EAST & AFRICA: SIC MARKET, BY DEVICE, 2024-2029 (USD MILLION) TABLE 107 SOUTH AMERICA: SIC MARKET, BY DEVICE, 2020-2023 (USD MILLION) TABLE 108 SOUTH AMERICA: SIC MARKET, BY DEVICE, 2024-2029 (USD MILLION) TABLE 109 OVERVIEW OF STRATEGIES ADOPTED BY KEY PLAYERS, 2020-2024 TABLE 110 SIC MARKET: DEGREE OF COMPETITION, 2023 TABLE 111 SIC MARKET: DEVICE FOOTPRINT TABLE 112 SIC MARKET: WAFER SIZE FOOTPRINT TABLE 113 SIC MARKET: APPLICATION FOOTPRINT TABLE 114 SIC MARKET: REGION FOOTPRINT TABLE 115 SIC MARKET: LIST OF KEY STARTUPS/SMES, 2023 TABLE 116 SIC MARKET: STARTUP/SME DEVICE FOOTPRINT TABLE 117 SIC MARKET: STARTUP/SME WAFER SIZE FOOTPRINT TABLE 118 SIC MARKET: STARTUP/SME APPLICATION FOOTPRINT TABLE 119 SIC MARKET: STARTUP/SME REGION FOOTPRINT TABLE 120 SIC MARKET: PRODUCT LAUNCHES, JUNE 2020-FEBRUARY 2024 TABLE 121 SIC MARKET: DEALS, JUNE 2020-FEBRUARY 2024 TABLE 122 SIC MARKET: OTHERS, JUNE 2020 -FEBRUARY 2024 TABLE 123 STMICROELECTRONICS: COMPANY OVERVIEW TABLE 124 STMICROELECTRONICS: PRODUCTS/SOLUTIONS/SERVICES OFFERED TABLE 125 STMICROELECTRONICS: PRODUCT LAUNCHES TABLE 126 STMICROELECTRONICS: DEALS TABLE 127 STMICROELECTRONICS: OTHERS TABLE 128 INFINEON TECHNOLOGIES AG: COMPANY OVERVIEW TABLE 129 INFINEON TECHNOLOGIES AG: PRODUCTS/SOLUTIONS/SERVICES OFFERED TABLE 130 INFINEON TECHNOLOGIES AG: PRODUCT LAUNCHES TABLE 131 INFINEON TECHNOLOGIES AG: DEALS TABLE 132 SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC: COMPANY OVERVIEW TABLE 133 SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC: PRODUCTS/SOLUTIONS/SERVICES OFFERED TABLE 134 SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC: PRODUCT LAUNCHES TABLE 135 SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC: DEALS TABLE 136 SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC: OTHERS TABLE 137 WOLFSPEED, INC.: COMPANY OVERVIEW TABLE 138 WOLFSPEED, INC.: PRODUCTS/SOLUTIONS/SERVICES OFFERED TABLE 139 WOLFSPEED, INC.: PRODUCT LAUNCHES TABLE 140 WOLFSPEED, INC.: DEALS TABLE 141 WOLFSPEED, INC.: OTHERS TABLE 142 ROHM CO., LTD.: COMPANY OVERVIEW TABLE 143 ROHM CO., LTD.: PRODUCTS/SOLUTIONS/SERVICES OFFERED TABLE 144 ROHM CO., LTD.: PRODUCT LAUNCHES TABLE 145 ROHM CO., LTD.: DEALS TABLE 146 FUJI ELECTRIC CO., LTD.: COMPANY OVERVIEW TABLE 147 FUJI ELECTRIC CO., LTD.: PRODUCTS/SOLUTIONS/SERVICES OFFERED TABLE 148 FUJI ELECTRIC CO., LTD.: PRODUCT LAUNCHES TABLE 149 TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION: COMPANY OVERVIEW TABLE 150 TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION: PRODUCTS/SOLUTIONS/SERVICES OFFERED TABLE 151 TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION: PRODUCT LAUNCHES TABLE 152 TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION: DEALS TABLE 153 TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION: OTHERS TABLE 154 MICROCHIP TECHNOLOGY INC.: COMPANY OVERVIEW TABLE 155 MICROCHIP TECHNOLOGY INC.: PRODUCTS/SOLUTIONS/SERVICES OFFERED TABLE 156 MICROCHIP TECHNOLOGY INC.: PRODUCT LAUNCHES TABLE 157 MICROCHIP TECHNOLOGY INC.: DEALS TABLE 158 MICROCHIP TECHNOLOGY INC. OTHERS TABLE 159 MITSUBISHI ELECTRIC CORPORATION: COMPANY OVERVIEW TABLE 160 MITSUBISHI ELECTRIC CORPORATION: PRODUCTS/SOLUTIONS/SERVICES OFFERED TABLE 161 MITSUBISHI ELECTRIC CORPORATION: PRODUCT LAUNCHES TABLE 162 MITSUBISHI ELECTRIC CORPORATION: DEALS TABLE 163 COHERENT CORP.: COMPANY OVERVIEW TABLE 164 COHERENT CORP.: PRODUCTS/SOLUTIONS/SERVICES OFFERED TABLE 165 COHERENT CORP.: DEALS

FIGURE 1 SIC MARKET SEGMENTATION FIGURE 2 SIC MARKET: RESEARCH DESIGN FIGURE 3 MARKET SIZE ESTIMATION: SUPPLY-SIDE ANALYSIS FIGURE 4 MARKET SIZE ESTIMATION METHODOLOGY: BOTTOM-UP APPROACH FIGURE 5 MARKET SIZE ESTIMATION METHODOLOGY: TOP-DOWN APPROACH FIGURE 6 MARKET SIZE ESTIMATION METHODOLOGY: SUPPLY-SIDE ANALYSIS (APPROACH 1) FIGURE 7 MARKET SIZE ESTIMATION METHODOLOGY: SUPPLY-SIDE ANALYSIS (APPROACH 2) FIGURE 8 DATA TRIANGULATION FIGURE 9 SIC MARKET: GLOBAL SNAPSHOT FIGURE 10 SIC MODULE SEGMENT TO REGISTER HIGHEST CAGR DURING FORECAST PERIOD FIGURE 11 >150 MM SEGMENT TO RECORD HIGHER GROWTH RATE DURING FORECAST PERIOD FIGURE 12 AUTOMOTIVE SEGMENT TO ACCOUNT FOR LARGEST MARKET SHARE IN 2029 FIGURE 13 ASIA PACIFIC TO DOMINATE MARKET DURING FORECAST PERIOD FIGURE 14 GROWING DEMAND FOR EVS AND RENEWABLE ENERGY SYSTEMS TO DRIVE MARKET FIGURE 15 AUTOMOTIVE SEGMENT TO ACCOUNT FOR LARGEST MARKET SHARE DURING IN 2024 FIGURE 16 SIC MODULES SEGMENT TO HOLD LARGEST MARKET SHARE IN 2029 FIGURE 17 UP TO 150 MM SEGMENT TO SECURE LARGER MARKET SHARE IN 2029 FIGURE 18 AUTOMOTIVE SEGMENT AND CHINA TO ACCOUNT FOR LARGEST ASIA PACIFIC MARKET SHARES FIGURE 19 SIC MARKET: DRIVERS, RESTRAINTS, OPPORTUNITIES, AND CHALLENGES FIGURE 20 GLOBAL SALES OF EVS, 2019-2021 FIGURE 21 GLOBAL SHARE OF RENEWABLE ENERGY GENERATION, 2022-2028 FIGURE 22 IMPACT ANALYSIS OF DRIVERS ON SIC MARKET FIGURE 23 IMPACT ANALYSIS OF RESTRAINTS ON SIC MARKET FIGURE 24 IMPACT ANALYSIS OF OPPORTUNITIES ON SIC MARKET FIGURE 25 IMPACT ANALYSIS OF CHALLENGES ON SIC MARKET FIGURE 26 SIC MARKET: SUPPLY CHAIN ANALYSIS FIGURE 27 SIC MARKET: ECOSYSTEM ANALYSIS FIGURE 28 INVESTMENT AND FUNDING SCENARIO, 2019-2023 FIGURE 29 TRENDS/DISRUPTIONS IMPACTING CUSTOMERS’ BUSINESSES FIGURE 30 AVERAGE SELLING PRICE OF PRODUCTS OFFERED BY KEY PLAYERS FIGURE 31 AVERAGE SELLING PRICE TREND OF SIC DEVICES, BY TYPE FIGURE 32 AVERAGE SELLING PRICE TREND OF SIC MOSFETS, BY REGION FIGURE 33 INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS OF TOP THREE VERTICALS FIGURE 34 KEY BUYING CRITERIA OF TOP THREE VERTICALS FIGURE 35 SIC MARKET: PORTER’S FIVE FORCES ANALYSIS, 2023 FIGURE 36 IMPORT DATA FOR HS CODE 284920-COMPLIANT PRODUCTS, BY COUNTRY, 2018-2022 FIGURE 37 EXPORT DATA FOR HS CODE 284920-COMPLIANT PRODUCTS, BY COUNTRY, 2018-2022 FIGURE 38 NUMBER OF PATENTS GRANTED, 2013-2023 FIGURE 39 TOP 10 COMPANIES WITH HIGHEST NUMBER OF GRANTED PATENTS, 2013-2023 FIGURE 40 SIC MODULES SEGMENT TO REGISTER HIGHEST CAGR DURING FORECAST PERIOD FIGURE 41 ASIA PACIFIC TO RECORD HIGHEST CAGR DURING FORECAST PERIOD FIGURE 42 >150 MM SEGMENT TO REGISTER HIGHER CAGR DURING FORECAST PERIOD FIGURE 43 AUTOMOTIVE SEGMENT TO DOMINATE MARKET DURING FORECAST PERIOD FIGURE 44 ASIA PACIFIC TO SECURE LARGEST MARKET SHARE IN 2029 FIGURE 45 CHINA TO REGISTER HIGHEST CAGR IN GLOBAL SIC MARKET DURING FORECAST PERIOD FIGURE 46 NORTH AMERICA: SIC MARKET SNAPSHOT FIGURE 47 EUROPE: SIC MARKET SNAPSHOT FIGURE 48 ASIA PACIFIC: SIC MARKET SNAPSHOT FIGURE 49 ORGANIC/INORGANIC STRATEGIES ADOPTED BY KEY PLAYERS, 2020-2024 FIGURE 50 SIC MARKET: MARKET SHARE ANALYSIS, 2023 FIGURE 51 SIC MARKET: COMPANY VALUATION, 2023 FIGURE 52 FINANCIAL METRICS (EV/EBITDA), 2024 FIGURE 53 SIC MARKET: BRAND/PRODUCT COMPARISON FIGURE 54 SIC MARKET: REVENUE ANALYSIS OF FIVE KEY PLAYERS, 2019-2023 (USD BILLION) FIGURE 55 SIC MARKET: COMPANY EVALUATION MATRIX: KEY PLAYERS, 2023 FIGURE 56 OVERALL FOOTPRINT FIGURE 57 SIC MARKET: COMPANY EVALUATION MATRIX: STARTUPS/SMES, 2023 FIGURE 58 STMICROELECTRONICS: COMPANY SNAPSHOT FIGURE 59 INFINEON TECHNOLOGIES AG: COMPANY SNAPSHOT FIGURE 60 SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC: COMPANY SNAPSHOT FIGURE 61 WOLFSPEED, INC.: COMPANY SNAPSHOT FIGURE 62 ROHM CO., LTD.: COMPANY SNAPSHOT FIGURE 63 FUJI ELECTRIC CO., LTD.: COMPANY SNAPSHOT FIGURE 64 TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION: COMPANY SNAPSHOT FIGURE 65 MICROCHIP TECHNOLOGY INC.: COMPANY SNAPSHOT FIGURE 66 MITSUBISHI ELECTRIC CORPORATION: COMPANY SNAPSHOT FIGURE 67 COHERENT CORP.: COMPANY SNAPSHOT

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